Chip thinning-based cleaning method

Abstract

The invention discloses a chip thinning-based cleaning method. The chip thinning-based cleaning method comprises the steps of providing a silicon substrate LED chip; pasting a front surface of the LEDchip onto a ceramic disc comprising wax paper; thinning the silicon substrate; removing silicon powder and wax on the silicon substrate by employing a pasting part with preset viscosity; and cleaningthe pasted LED chip with an organic substance. Before cleaning the LED chip with a cleaning liquid, the silicon powder and the wax are removed by a physical mode, the electrical characteristic of theLED chip cannot be affected, and environmental protection is facilitated.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a cleaning method. Background technique [0002] In the process of chip preparation, the growth substrate usually needs to be thinned, and it needs to be cleaned after thinning. If the cleaning is not clean, the quality of the chip will be directly affected. [0003] At present, in the process of thinning the silicon substrate, the front of the chip is generally stuck to a ceramic disc with wax paper, and the back of the substrate is ground and thinned with a grinder, and then the chip is removed for cleaning. During the cleaning process, the residual wax and silicon powder are first cleaned with a dewaxing solution, then ultrasonically cleaned with organic matter, and finally the metal is steamed on the back. However, this cleaning method still has the phenomenon of unclean cleaning, which leads to serious peeling off of the back gold of the chip; in addition, ultrasonic...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a cleaning method based on chip thinning, which effectively solves the technical problem in the prior art that the silicon substrate is not clean after thinning

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