Magnetic field probe adopting isolation via-hole structure

Abstract

The invention adopts a magnetic field probe adopting an isolation via-hole structure. The magnetic field probe comprises a symmetric non-shielding ring, a grounding via hole, a strip line, isolation via holes, a signal via hole, an adapter, a non-shielding ring symmetric arm extension line, a strip line upper shielding layer, a strip line lower shielding layer, a strip line medium and a strip linesignal line. The symmetric non-shielding ring is arranged in the interlayer of the medium material of the strip line to ensure strength of the symmetric non-shielding ring; one arm of the symmetric non-shielding ring is directly connected with the strip line signal line, and the other arm is connected with the upper shielding layer and the lower shielding layer of the strip line through the non-shielding ring symmetric arm extension line and through the grounding via hole; the isolation via holes are arranged in the strip line, and are connected with the upper shielding layer and the lower shielding layer of the strip line, and meanwhile, are arranged between the grounding via hole and the strip line signal line; and the other end of the strip line signal line is connected with the adapter through the signal via hole.

Description

【Technical field】 [0001] The invention belongs to the field of electromagnetic field testing, and in particular relates to a magnetic field probe structure for testing a broadband high-sensitivity near-field magnetic field. Specifically, the near-field magnetic field distribution parameters of a tested object can be obtained through the near-field testing of the probe. 【Background technique】 [0002] With the rapid development of electrical engineering, electronic science and technology, computer technology, control theory and control engineering and other technologies, the application of electronic circuits in all walks of life occupies an indispensable position. The operating frequency band of electronic circuits is continuously expanding, and the integration and complexity are getting higher and higher. Any trace in the circuit may become a source of radiated magnetic field. Coupling between different trace radiations is one of the main causes of system-level EMC problems...

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of the existing near-field magnetic field probes, the purpose of the present invention is to provide a magnetic field probe for near-field testing, which can solve the problem that the signal current cannot be tested due to the weak signal current during broadband testing and the introduction of The pitfalls of measurement error

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