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Electronic Component Manufacturing Equipment

A technology for electronic components and manufacturing equipment, which is applied in the field of electronic component manufacturing equipment, can solve the problems of resin overflowing to the bottom of the chip, easy to impact leads, short circuit of wires, etc., achieve good sealing, good injection molding effect, and improve product quality. The effect of yield

Active Publication Date: 2020-04-07
重庆市长寿区普爱网络科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are still the following defects in the current injection molding process: resin is injected from the side of the mold, not only it is easy for the resin to overflow to the bottom of the chip, resulting in overflow; moreover, the resin is easy to impact the lead wire at the end of the chip near the injection port, making each lead wire Under the action of the fluid, there is an offset and contact between them, causing a short circuit of the wires, resulting in the scrapping of the chip; increasing the defective rate of the product

Method used

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  • Electronic Component Manufacturing Equipment

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Embodiment Construction

[0019] Further detailed explanation through specific implementation mode below:

[0020] The reference signs in the accompanying drawings of the description include: frame 1, fixed groove 2, air outlet 20, air inlet 21, annular cooling groove 22, cover plate 3, injection port 30, ball 31, slide rail 32, injection cavity 4 , drainage rod 5, fixing ring 50, rocker 6, gear 60, sliding rack 61, cylinder 7, piston 70, piston rod 71, connecting rod 8, fixing belt 80, fixing buckle 81, chip 9, gold wire 90 .

[0021] The embodiment is basically as attached figure 1 Shown:

[0022] The electronic component manufacturing equipment includes a frame 1, a mould, a drainage mechanism and an air control mechanism.

[0023] The overall mold is in the shape of a cylinder, including a fixing groove 2 and a cover plate 3 . The top of the fixing groove 2 is open, and an annular groove is provided on the side wall of the top of the fixing groove 2; Port 21; the outer circumference of the fix...

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Abstract

The invention belongs to the technical field of production of electronic products, and specifically relates to electronic component manufacturing equipment. The equipment includes a rack and a mold, and also includes a drainage mechanism and an air control mechanism; the mold includes a fixed groove with a top opening and a cover plate used for covering the fixed groove, the bottom of the fixed groove is provided with an air outlet with an air outlet one-way valve and an air inlet with an air inlet one-way valve, an injection molding port is arranged in the cover plate, and the cover plate isslidably connected with the fixed groove; the drainage mechanism includes a drainage rod, a rocker, a gear and a sliding rack; and the air control mechanism includes a cylinder, a piston and a pistonrod. By adoption of the scheme, resin can be effectively prevented from flowing to the bottoms of chips in an injection molding process, the risk of a chip lead short circuit is reduced, and the product yield is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic product production, and in particular relates to electronic component manufacturing equipment. Background technique [0002] There are many classifications of electronic components. Individual devices such as resistors and capacitors are called basic devices, while chips integrate many basic devices into a very small circuit board, so they are also called integrated circuits. The chip is small in size and is the most important part of electronic products, undertaking the functions of computing and storage. The complete process of chip production includes several links such as chip design, chip production, packaging production, and cost testing. Among them, chip packaging is to install a shell outside the semiconductor integrated circuit chip, so as to place, fix, seal, protect and enhance the electrothermal performance of the chip, and the packaging process is also a bridge between the interna...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B29C45/26
CPCB29C45/26H01L21/67121H01L21/67126
Inventor 李天翼
Owner 重庆市长寿区普爱网络科技有限公司
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