Adsorption method of warped wafer and device using the adsorption method
A wafer and warping technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve problems such as affecting productivity, reducing wafer warpage, and inability of wafer to be adsorbed, so as to reduce costs, The effect of improving the yield
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[0035] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
[0036] Preferred embodiment:
[0037] This preferred embodiment discloses an adsorption method for a warped wafer. The adsorption method is to use a normal wafer to form a normal adsorption state on the chuck 1, then use a warped wafer 2 to replace the normal wafer, and adjust the position of the warped wafer 2 on the chuck 1 horizontally and / or rotate until it is warped. The curved wafer 2 is adsorbed on the chuck 1 .
[0038] The production and processing of semiconductor wafers takes a relatively long time, especially those wafers with more complicated processing procedures. At the final stage of the entire processing (such as engraving metal wiring or pressing points), it is found that some products cannot be processed due to warping and deformation. Re-introduction of a certain amount of prod...
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