A partition wall board steam curing method and partition wall board steam curing device
A steam curing and partition board technology, applied in ceramic molding machines, manufacturing tools, etc., can solve the problems of lack of precise regulations, difficult temperature and humidity control, etc., and achieve the effect of high flexibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0067] This embodiment provides a steam curing method for a partition wall, which includes the following steps:
[0068] Bind every 5 partition boards into a bundle, and every 2 bundles corresponds to a curing layer and stack them in the curing room. During the curing process, the oil heating pipeline in the curing room is used for temperature control, and the steam pipeline in the curing room is used to enter Steam, steam temperature is 110°C, pressure is 8kg / cm 2. The temperature control in the curing process includes a heating stage, a second heating stage, a third heating stage and a cooling stage.
[0069] Among them, the relative humidity is maintained at about 90% in the first heating stage, the second heating stage and the third heating stage, and it is carried out under airtight conditions; in the first heating stage, the temperature in the curing room is raised to 23 ° C and kept for 2 hours; In the second heating stage, the temperature in the curing room was raise...
Embodiment 2
[0071] This embodiment provides a steam curing method for a partition wall, which includes the following steps:
[0072] Bind every 7 partition boards into a bundle, and every 3 bundles correspond to a curing layer and stack them in the curing room. During the curing process, the oil heating pipeline in the curing room is used for temperature control, and the steam pipeline in the curing room is used to Steam, steam temperature is 130°C, pressure is 10kg / cm 2 . The temperature control in the curing process includes a heating stage, a second heating stage, a third heating stage and a cooling stage.
[0073] Among them, the relative humidity is kept at about 100% in the first heating stage, the second heating stage and the third heating stage, and it is carried out under airtight conditions; in the first heating stage, the temperature in the curing room is raised to 27°C and kept for 3 hours; In the second heating stage, the temperature in the curing room is raised to 45°C at ...
Embodiment 3
[0075] This embodiment provides a steam curing method for a partition wall, which includes the following steps:
[0076] Bind every 6 partition boards into a bundle, and every 3 bundles correspond to a curing layer and stack them in the curing room. During the curing process, the oil heating pipeline in the curing room is used for temperature control, and the steam pipeline in the curing room is used to enter Steam, steam temperature is 120°C, pressure is 9kg / cm 2 . The temperature control in the curing process includes a heating stage, a second heating stage, a third heating stage and a cooling stage.
[0077] Among them, the relative humidity is kept at about 95% in the first heating stage, the second heating stage and the third heating stage, and it is carried out under airtight conditions; in the first heating stage, the temperature in the curing room is raised to 25 ° C and kept for 3 hours; In the second heating stage, the temperature in the curing room was raised to 5...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com