Processing workbench and processing system for PCBs (printed circuit boards)

Abstract

The invention provides a processing workbench and a processing system for PCBs (printed circuit boards). The processing workbench comprises a rotatable rotating disc, a fetching manipulator, a laser cutting machine, a splitting manipulator and a collecting manipulator are uniformly distributed above the rotating disc along the clockwise direction of the rotating disc, and a rotating device for rotating the PCBs to a specified processing position is arranged below the rotating disc. The rotatable rotating disc is adopted for various processes like fetching, cutting, spitting and collecting, sothat compared with conventional board splitting modes, the processing workbench has the advantage that board splitting efficiency can be improved by higher than 10 times.

Description

technical field [0001] The invention belongs to the technical field of PCB board cutting, and in particular relates to a laser PCB board processing workbench and a processing system. Background technique [0002] In the production and processing of electronic products, PCB boards are often used. The PCB board in the prior art is a whole traditional PCB board. The general cutting equipment of PCB boards uses contact means such as high-pressure water or mechanical tools (such as grinding wheels). Realize the cutting of the substrate. On the one hand, due to the need to subject the substrate to a certain cutting force when using contact cutting, the clamping force on the substrate will increase, which will easily damage the tiny circuits in the board; on the other hand, high-pressure water cutting and mechanical cutting It will cause water droplets and cutting powder on the substrate, which requires additional processes to be processed, which not only increases the production ...

AI Technical Summary

Problems solved by technology

On the one hand, since the substrate needs to be subjected to a certain cutting force when contact cutting is used, the clamping force on the substrate increases, which easily damages the tiny circuits in the board; on the other hand, high-pressure water cutting and mechanical tool cutting also It will cause water droplets and cutting powder on the substrate, which requires additional processing, which not only increases the production process, reduces production efficiency, but also increases production costs

In addition, the traditional PCB board cutting equipment, whether it is cutting with high-pressure water or grinding wheel, has a relatively low degree of automation. Affected by the cutting force, the positioning and clamping mechanism of the PCB board is easy to damage the circuit on the board, and the processing accuracy is not very good. high

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