A method of manufacturing a multi-frequency antenna device

Abstract

The invention provides a making method of a multi-frequency antenna device. The multi-frequency antenna device comprises a first metal layer, a second metal layer, a grounding layer, and dielectric substrates located between the metal layers and between the metal layers and the grounding plate respectively. The multi-frequency antenna device is characterized in that a meta-material layer is arranged between the first metal layer and the second metal layer. The contradiction of high gain, low interference and small size which can be hardly overcome by the traditional method of making a stackedantenna is solved. Through flexible and skillful setting of antenna wiring and a coupling isolation unit, very good frequency band isolation characteristic is realized. The meta-material layer is arranged between the two metal layers of the antenna. Through the special conduction characteristic of the meta-material, the size of the antenna is reduced, and the isolation between high and low frequencies is improved.

Description

technical field [0001] The invention belongs to the field of communication antennas, and more specifically relates to a manufacturing method of a multi-frequency antenna device for smart equipment. Background technique [0002] With the rapid development of wireless communication, antennas play a more important role in wireless communication smart device products. Today, as mobile devices have become an indispensable item in people's lives, it has also led to the vigorous development of the communication industry. Because of this, various small antennas have been developed and widely used in various For mobile devices, for example, planar inverted-F antennas, monopole antennas, stereo antennas, etc. However, the above-mentioned antennas of the known art have many disadvantages. [0003] For example, the structure of the planar inverted-F antenna is relatively complicated, and because the planar inverted-F antenna is a three-dimensional antenna, the additional mold cost and...

AI Technical Summary

Problems solved by technology

However, the antennas of the above-mentioned known technologies have many disadvantages

[0003] For example, the structure of the planar inverted-F antenna is relatively complicated, and because the planar inverted-F antenna is a three-dimensional antenna, the additional mold cost and assembly cost lead to high cost, and the commercial cost is too high, and its commercial competitiveness will decrease. will reduce

The three-dimensional antenna is too large to be placed in the increasingly smaller mobile devices. If the three-dimensional antenna is forcibly reduced in size to achieve miniaturization, it will easily lead to a decline in antenna performance.

Especially in the field of multi-frequency antennas, the small size often causes coupling interference between frequency bands. How to take into account miniaturization while ensuring interference between different frequency bands has always been a difficult problem for people.

[0004] Therefore, how to propose a multi-frequency antenna, which can effectively improve the problems of complex structure, high cost, and poor isolation performance of conventional antennas, has become urgent.

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