Circuit board manufacturing method, circuit board and mobile terminal

A manufacturing method and circuit board technology, which are applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as the overall thickness of the circuit board.

Inactive Publication Date: 2018-07-24
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a method for manufacturing a circuit board, a circuit board and a mobile terminal, so as to solve the problem that the existing circuit board has a relatively thick overall thickness

Method used

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  • Circuit board manufacturing method, circuit board and mobile terminal
  • Circuit board manufacturing method, circuit board and mobile terminal
  • Circuit board manufacturing method, circuit board and mobile terminal

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] see figure 1 , figure 1 It is a flowchart of a method for manufacturing a circuit board provided by an embodiment of the present invention, such as figure 1 shown, including the following steps:

[0026] Step 101 , providing an initial circuit board, the initial circuit board includes a conductive layer and a substrate disposed on one side of the conductive layer.

[0027] In this step, a substrate including a conductive layer and one side of...

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Abstract

The invention provides a circuit board manufacturing method, a circuit board and a mobile terminal. The manufacturing method comprises the steps that an initial circuit board is provided, wherein theinitial circuit board comprises a conductive layer and a substrate arranged on one side of the conductive layer; according to a preset trace pattern, a corresponding hollow region is formed on the substrate; a conductive material is arranged in the hollow region to form a first conductive line; and a second conductive line corresponding to the first conductive line is formed on the conductive layer to acquire a finished circuit board. According to the invention, the thickness of the conductive lines can be increased without increasing the overall thickness of the circuit board, and the demandof thick lines of the circuit board can be satisfied.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a method for manufacturing a circuit board, a circuit board and a mobile terminal. Background technique [0002] As mobile terminals such as smartphones play more and more important roles in users' lives, users have higher and higher performance requirements for mobile terminals, especially for charging capabilities and battery life of mobile terminals. The core component that determines the charging capability and battery life of the mobile terminal is the battery circuit board of the mobile terminal, especially the conductive lines on the battery circuit board, such as the thickness of the line. By increasing the line thickness, the current carrying capacity can be effectively increased and the battery capacity can be reduced. The heat generated during the operation of the circuit board. [0003] At present, the performance of the battery circuit board is generally impr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24H05K3/10H05K1/02
CPCH05K3/24H05K1/0265H05K3/107H05K2201/0338
Inventor 王强徐波殷向兵
Owner VIVO MOBILE COMM CO LTD
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