Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film

Abstract

An embodiment of the present invention provides a method for preparing an electromagnetic shielding film, a circuit board, and an electromagnetic shielding film, wherein the electromagnetic shielding film includes a first shielding layer, a second shielding layer, an adhesive film layer, and several convex particles; the first A shielding layer includes opposite first surfaces and second surfaces, and the second surface is an undulating uneven surface; the plurality of convex particles are attached to the second surface of the first shielding layer; the second The shielding layer is arranged on the second surface of the first shielding layer and covers the plurality of convex particles, so that protrusions are formed on the outer surface of the second shielding layer at positions corresponding to the convex particles, While recesses are formed at other positions, the undulation of the outer surface of the second shielding layer is greater than the undulation of the second surface; the adhesive film layer is disposed on the outer surface of the second shielding layer.

Description

technical field [0001] The invention relates to the field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique [0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace. [0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is electromagnetic shielding (Electromagnetic Interference Shielding, referred to as EMI Sh...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the embodiment of the present invention is to provide a preparation method of electromagnetic shielding film, circuit board and electromagnetic shielding film, which can effectively solve the phenomenon of high temperature explosion due to insufficient glue capacity in the prior art, strong piercing force and high peeling strength , to avoid the explosion phenomenon

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