A substrate cutting device

Abstract

The invention discloses a substrate cutting device which comprises a cutting part and an electrostatic discharge component. The cutting part is used for cutting a substrate along a cutting line on thesubstrate, the electrostatic discharge component is fixed relative to the cutting part and used for contacting with the substrate in the cutting process of the cutting part to release electrostatic charge. According to the substrate cutting device, the electrostatic discharge component is arranged at a position close to the cutting part and synchronously advances along with the cutting part, theelectrostatic charge generated by cutting can be grounded through the electrostatic discharge component by the aid of the cutting line, so that the electrostatic charge can be rapidly released, the risk of electrostatic injury in the cutting process is effectively reduced, the electrostatic discharge component can be attached to the cutting surface of the substrate, and cut glass scraps can be cleaned in the advancing process. In addition, the glass scraps can be blown away by airflow of a ventilating duct, and the risk of exposed line scratch of the TFT (thin film transistor) substrate is reduced.

Description

technical field [0001] The present invention relates to the technical field of carrying, in particular to a substrate cutting device. Background technique [0002] In the liquid crystal cell manufacturing process of the liquid crystal display device, after the frame glue is pasted, the large sheet needs to be cut into small pieces. In the cutting process, a diamond cutter wheel is generally used, and the upper and lower cutting methods are adopted, and then the pieces are split one by one. After the small pieces are pasted with polarizers, the liquid crystal cell is produced. During the cutting process, the diamond cutter wheel is always in high-speed motion, and it will generate a lot of static electricity when it rubs against the glass sharply. If left on the glass, post-processing may also cause electrostatic damage. The current practice is to install an ion fan at the cutting end to dissipate static electricity. At the same time, a large amount of glass shavings will ...

AI Technical Summary

Problems solved by technology

[0003] However, in the production process of existing equipment, factors such as the blowing angle and distance of the ion blower and the dissipation capacity of the ion blower are often encountered, resulting in the untimely dissipation of static electricity in some positions, resulting in static electricity damage on the surface of the liquid crystal cell, and at the same time, during the cutting process to cleaning In the cleaning process, because glass shavings remain on the exposed lines of the TFT substrate, the lines are scratched during the process of glass turning, transportation, brush cleaning, etc.

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