Method for acidic copper plating of hardware

A technology of acid copper plating and hardware, applied in electrolytic components, cells, electrolytic process, etc., to achieve the effect of improving copper plating speed, shortening plating time, and fast deposition speed

Inactive Publication Date: 2018-07-27
FOSHAN JIEYA PLASTIC HARDWARE PROD CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for acidic copper plating

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0011] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in combination with the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0012] The invention provides a technical solution: a method for acidic copper plating of hardware, the copper plating raw materials are as follows: the mass number of copper sulfate is 250g / L; the mass number of sulfuric acid is 70g / L; the mass number of chloride ions is 35mg / L; The concentration and volume of BFJ-210Mμ is 7.5ml / L; the concentration and volume of BFJ-210A is 0.8ml / L; the concentration and volume of BFJ-210B is 0.8ml / L; the cathode current density is 6A / dm 2 ; Anode current ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for acidic copper plating of hardware. The copper plating comprises of, by mass, 250g/L of copper sulfate, 70g/L of sulfuric acid, and 35mg/L of chloride ion; the copper plating comprises of, by concentration volume, 7.5ml/L of BFJ-210M[um], 0.8ml/L of BFJ-210A, and 0.8ml/L of BFJ-210B; and the copper plating comprises of, by electric current density, 6A/dm<2> of cathode, and 5A/dm<2> of anode. Plating solution is prepared and the method includes the steps that 1, 1/2 volume of distilled water is added to a cylinder to be used; 2, the calculated amount of copper sulfate is added to the cylinder to be used; 3, activated carbon solution is added to the cylinder to be used, and the solution concentration is 2g/L; and 4, the calculated amount of sulfuric acid is added to a plating bath. The method for the acidic copper plating of the hardware realizes rapid brightening and has excellent filling degree, and high filling degree can be obtained even in the lowelectric current density region; and the deposition speed is high, at 4.5 amperes per square decimeter of the electric current density, a 1 micron copper layer can be plated per minute, and thereforethe plating time is shortened, thereby greatly increasing the copper plating speed of the hardware.

Description

technical field [0001] The invention relates to the technical field of copper plating equipment, in particular to a method for acid copper plating of hardware. Background technique [0002] The acid copper plating process is suitable for the intermediate plating layer as a decorative plating layer, used for plating various lighting, hardware tools and daily necessities, and is also widely used in plastic plating, PCB plating and electroforming. The traditional copper plating solution tends to cause potholes on the surface of the hardware during the copper plating process, and the solution deposition rate is slow, which reduces the copper plating efficiency. Contents of the invention [0003] The object of the present invention is to provide a method for acidic copper plating of hardware to solve existing technical defects and technical requirements that cannot be met. [0004] In order to achieve the above object, the present invention provides the following technical sol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C25D3/38C25D21/10
CPCC25D3/38C25D21/10
Inventor 黄德勇
Owner FOSHAN JIEYA PLASTIC HARDWARE PROD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap