Heat dissipation cabinet and server nodes

Abstract

The invention provides a heat dissipation cabinet and server nodes capable of improving the heat dissipation effect. The heat dissipation cabinet comprises a cabinet body, a plurality of server nodesarranged in the cabinet body and a plurality of cold plates for carrying out heat dissipation on the server nodes, wherein the side surface, laminated with the corresponding cold plate, of each servernode is of a first bevel-shaped structure; the side surface, laminated with the corresponding server node, of each cold plate is of a second bevel-shaped structure; and the first bevel-shaped structure and the second bevel-shaped structure are arranged in parallel. A first side surface of each radiator is laminated with a corresponding business chip, and a second side surface of each radiator isconnected with the corresponding cold plate, so that each radiator can transfer heat generated by the corresponding business chip in the business processing process to the corresponding cold plate; and heat dissipation is directly carried out through the radiators, so that heat transfer path of the heat between the business chips and the corresponding cold plates is reduced and the heat dissipation efficiency on the business chips is effectively improved.

Description

technical field [0001] The invention relates to the technical field of communications, in particular to a cooling cabinet and a server node. Background technique [0002] In recent years, with the continuous development of Internet technology, the integration requirements of electronic equipment are getting higher and higher, and more and more highly integrated high-power consumption chips are applied to server nodes. In order to solve the problem of hot spots in the server node, the server node and the cold plate can be pasted together for heat transfer. The way of bonding will determine the heat transfer capacity, which is the key technology of the solution. [0003] Such as figure 1 As shown, the industry solution is that the side of the server node 101 is attached to the cold plate. Specifically, a heat sink substrate 102 is added to the server node 101, and the heat sink substrate 102 is connected to the copper plate 104 on the side through the heat pipe 103, and the ...

AI Technical Summary

Problems solved by technology

[0004] The main problem of the existing technology is that the heat transfer path from the server node 101 to the cold plate 105 of the machine frame is too long, reaching about 100mm, increasing the thermal resistance

The contact area between the copper plate 104 of the server node 101 and the cold plate 105 of the chassis is limited by height and cannot be made larger, resulting in a large contact thermal resistance and limited maximum heat dissipation power

Moreover, the dissipated heat is pulled away through multiple heat pipes, and the cost is relatively high

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