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A silicon wafer edge protection device

A silicon wafer edge protection and silicon wafer technology, which is applied in photoplate-making process exposure devices, microlithography exposure equipment, instruments, etc., can solve the problems of long process connection time and low efficiency, so as to improve the protection efficiency and shorten the connection time. , the effect of high positioning accuracy

Active Publication Date: 2020-11-13
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to make up for the existing technical defects, the present invention provides a silicon wafer edge protection device to solve the problems that the existing protection ring device does not move with the exposure table during the process of protecting the edge of the silicon wafer, and the process connection time is long and the efficiency is low.

Method used

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  • A silicon wafer edge protection device
  • A silicon wafer edge protection device
  • A silicon wafer edge protection device

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Experimental program
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Effect test

Embodiment 1

[0043] Such as figure 1 with 8 As shown, the silicon wafer edge protection device of the present invention includes a protection ring 3, a fixing mechanism 4, and a lifting mechanism 5, wherein the protection ring 3 is installed on the fixing mechanism 4, and the lifting mechanism 5 is fixedly installed on the exposure table 1, and lifts The mechanism 5 drives the fixing mechanism 4 to perform lifting movement, that is, drives the protection ring 3 to perform the lifting movement; the protection ring 3 is a ring structure with a hollow center and solid edges, and the specifications of the protection ring 3 match the specifications of the silicon wafer 2 The positioning detection mechanism is used to detect whether the protection ring 3 moves to a set position, and ensure repeat positioning accuracy between the silicon wafer 2 and the protection ring 3 .

[0044] It should be noted that, according to different specifications of silicon wafers 2, the corresponding structure of ...

Embodiment 2

[0056] Such as Figure 12 As shown, the difference between this embodiment and Embodiment 1 is that the lifting mechanism of this embodiment adopts a lateral movement mechanism, and the lateral movement mechanism includes a hinge rod mechanism 54, a guide mechanism 55 and a second cylinder drive mechanism 56, and the hinge One end of the rod mechanism 54 , the guiding mechanism 55 and the second cylinder driving mechanism 56 are all installed on the bottom of the mounting seat 41 , and the other end is installed on the exposure table 1 .

[0057] Further, as Figure 14 As shown, the hinge rod mechanism 54 includes a plurality of hinge rods. In this embodiment, four hinge rods are preferably distributed symmetrically at the bottom of the mounting seat 41 to form a parallelogram. Each hinge rod includes a connecting rod and two hinges. Two ends of the connecting rod are respectively connected to the mounting seat 41 and the exposure table 1 through the two hinges.

[0058] Fur...

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PUM

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Abstract

The invention provides a silicon wafer edge protection device comprising a protection ring, a fixing mechanism and a lifting mechanism; the protection ring is mounted on the fixing mechanism, and thelifting mechanism is fixed on an exposure table and drives the fixing mechanism to lift up and down to allow the protection ring to adjacent to or away from a silicon wafer edge. The protection ring of the silicon wafer edge protection device is mounted on the exposure table and moves together with the exposure table. During each silicon wafer exposure process, the connection time is shortened, the production efficiency is improved, the silicon wafer edge protection process is high in location accuracy, and protection efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer protection, in particular to a silicon wafer edge protection device. Background technique [0002] Lithography equipment is mainly used in the manufacture of integrated circuits IC or other micro-devices. With a photolithographic apparatus, a mask pattern can be imaged on a photoresist-coated wafer, such as a semiconductor or an LCD panel. The photolithography device is exposed through the projection objective lens, and the designed mask pattern is transferred to the photoresist. During the exposure process of the negative photoresist process, the edge of the silicon wafer is easily damaged, so a silicon wafer edge protection device is produced. [0003] The process route of the conventional silicon wafer edge protection mechanism is: before exposure, the silicon wafer is loaded onto the exposure table, the exposure table moves to the transfer position, after the protection ring is placed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70733G03F7/70741G03F7/70775
Inventor 蔡晨王鑫鑫刘臣才
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD