Interconnection structure and manufacturing method thereof

Abstract

An interconnection structure includes a substrate, a dielectric layer, a first conductive pattern and a second conductive pattern. The dielectric layer is disposed on the base and has an opening. The first conductive pattern is disposed in the opening. The second conductive pattern is disposed on the first conductive pattern and exposes an exposed portion of the first conductive pattern. The exposed portion of the first conductive pattern has a gap.

Description

technical field [0001] The present invention relates to a conductive structure and its manufacturing method, and in particular to an interconnect structure and its manufacturing method. Background technique [0002] With the development of the semiconductor industry, when the integration of integrated circuits increases and the surface of the chip cannot provide enough area to make the required interconnection, the multi-layer interconnection design has gradually become a must for many integrated circuits. way of design. [0003] As the semiconductor device shrinks gradually, the overlay window between the upper layer conductive device and the lower layer conductive device below it in the multilayer interconnection structure will also become smaller, so misalignment is prone to occur. When misalignment occurs between the upper layer conductive component and the lower layer conductive component in the multilayer interconnection structure, the upper layer conductive component...

AI Technical Summary

Problems solved by technology

In this way, two adjacent upper-layer conductive components will generate a bridging path (bridging path) through the exposed lower-layer conductive component, thereby causing a circuit bridging (circuit bridging) defect.

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