This application relates to the field of power converter technology, specifically to a
power module and a power converter. This application aims to solve the technical problem of excessive parasitic
inductance introduced into the circuit board, leading to significant
power loss in the power converter. Embodiments of this application provide a
power module, including a
package, a first power
chip, and a second power
chip. Both the first and second power chips are packaged within the
package. The
power module also includes connecting lines disposed within the
package. The first and second power chips are electrically connected via these connecting lines, facilitating the integration of the power module and improving the
power density of the power converter. Because the connecting lines are disposed within the package, and the first and second power chips are electrically connected via these connecting lines, the trace distance on the circuit board can be reduced, lowering the parasitic
inductance on the circuit board and thus reducing the
power loss of the power converter.