Heat dissipation package structure

Abstract

A heat-dissipating package structure is provided. By disposing a connecting member on a carrier member provided with an electronic component, and then disposing a heat dissipating member on the electronic component and the connecting member, a supporting force or a pulling force is provided by the connecting member to avoid delamination between the heat dissipating member and the electronic component.

Description

technical field [0001] The invention relates to a package structure, especially a heat dissipation package structure. Background technique [0002] With the improvement of the function and processing speed of electronic products, semiconductor chips, which are the core components of electronic products, need to have higher density electronic components (Electronic Components) and electronic circuits (Electronic Circuits). It produces a larger amount of heat energy, and the encapsulation compound covering the semiconductor chip is a thermal conductivity of only 0.8Wm -1 k -1 The poor heat transfer material (that is, the heat dissipation efficiency is not good), so if the heat generated cannot be effectively dissipated, it will cause damage to the semiconductor chip or cause product reliability problems. [0003] Therefore, in order to quickly dissipate heat energy into the atmosphere, a heat sink (Heat Sink or Heat Spreader) is usually arranged in the semiconductor package ...

AI Technical Summary

Problems solved by technology

[0007] However, when the thickness of the semiconductor package structure 1 is required to be thinner and its area is getting larger and larger, the deformation (that is, warpage) will be caused by the difference in coefficient of thermal expansion (CTE Mismatch) between the heat sink 13 and the TIM layer 12. Degree) is more obvious, and when the amount of deformation is too large, delamination (such as Figure 1B The gap d) shown not only reduces the heat conduction effect, but also causes poor appearance of the semiconductor package structure 1, and even seriously affects the reliability of the product.

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