Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation package structure

A packaging structure and heat dissipation technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of poor appearance of semiconductor packaging structure 1, affect product reliability, and reduce heat conduction effect, so as to improve trust performance, improve thermal conductivity, and prevent delamination

Active Publication Date: 2020-10-02
SILICONWARE PRECISION IND CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when the thickness of the semiconductor package structure 1 is required to be thinner and its area is getting larger and larger, the deformation (that is, warpage) will be caused by the difference in coefficient of thermal expansion (CTE Mismatch) between the heat sink 13 and the TIM layer 12. Degree) is more obvious, and when the amount of deformation is too large, delamination (such as Figure 1B The gap d) shown not only reduces the heat conduction effect, but also causes poor appearance of the semiconductor package structure 1, and even seriously affects the reliability of the product.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation package structure
  • Heat dissipation package structure
  • Heat dissipation package structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0050] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "upper", "lower",...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A heat-dissipating package structure is provided. By disposing a connecting member on a carrier member provided with an electronic component, and then disposing a heat dissipating member on the electronic component and the connecting member, a supporting force or a pulling force is provided by the connecting member to avoid delamination between the heat dissipating member and the electronic component.

Description

technical field [0001] The invention relates to a package structure, especially a heat dissipation package structure. Background technique [0002] With the improvement of the function and processing speed of electronic products, semiconductor chips, which are the core components of electronic products, need to have higher density electronic components (Electronic Components) and electronic circuits (Electronic Circuits). It produces a larger amount of heat energy, and the encapsulation compound covering the semiconductor chip is a thermal conductivity of only 0.8Wm -1 k -1 The poor heat transfer material (that is, the heat dissipation efficiency is not good), so if the heat generated cannot be effectively dissipated, it will cause damage to the semiconductor chip or cause product reliability problems. [0003] Therefore, in order to quickly dissipate heat energy into the atmosphere, a heat sink (Heat Sink or Heat Spreader) is usually arranged in the semiconductor package ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/31
CPCH01L23/3121H01L23/367H01L2224/73204H01L2224/73253
Inventor 林长甫姚进财余国华周世民黄富堂
Owner SILICONWARE PRECISION IND CO LTD