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Thermoforming apparatus and thermoforming method

A technology of thermoforming and conveying equipment, which is applied in the field of thermoforming equipment and can solve problems such as multiple heating times

Active Publication Date: 2020-10-27
ASANO LABORATORIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially in the case of thicker sheets, more heating time is required for sheet softening

Method used

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  • Thermoforming apparatus and thermoforming method
  • Thermoforming apparatus and thermoforming method
  • Thermoforming apparatus and thermoforming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0057] Next, a thermoforming apparatus and a thermoforming method according to an embodiment of the present invention will be described based on the drawings.

[0058] Such as Figure 1 to Figure 3 As shown, the thermoforming apparatus 1 according to this embodiment adopts a hot plate heating system. The thermoforming apparatus 1 is an apparatus for covering the surface 6 a of a molding base 6 with a sheet 4 heated and softened by heating plates 3 (upper heating plate 3A, lower heating plate 3B). The heating plates 3 (upper heating plate 3A, lower heating plate 3B) are provided as a pair of upper and lower heating plates. Molding substrate 6 such as Figure 7 As shown, it is arranged in the chamber 2A of the lower frame 2 (substrate supply unit).

[0059] Among them, as thermoformed product 6A (refer to Figure 9 ), which can be used as parts with inner and outer surfaces such as automobile parts. The thermoformed product 6A is a thermoformed product obtained by adsorbing...

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PUM

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Abstract

The thermoforming apparatus includes: an upper heating plate having a first heating surface for heating the sheet from above; a lower heating plate having a second heating surface for heating the sheet from below; The base of the material is configured so that the base can be detached from the molding base material, and the molding base material can be arranged below the sheet material with respect to the first heating surface. Position, the upper heating plate and the lower heating plate can be heated simultaneously from the top and the bottom of the sheet, the lower heating plate is set to be able to move in the horizontal direction relative to the lower position of the upper heating plate, and the The sheet heated and softened by the upper heating plate and the lower heating plate is mold-molded with respect to the molding base held on the base or bonded to the molding base.

Description

technical field [0001] The invention relates to a thermoforming device and a thermoforming method. [0002] This application claims priority based on Japanese Patent Application No. 2015-215036 for which it applied in Japan on October 30, 2015, and uses the content here. Background technique [0003] In general, as a device for bonding a skin sheet (hereinafter referred to as a sheet) to the outer surface of a molding base, there are known vacuum press lamination molding devices that perform radiation heating in upper and lower chambers and thermoforming devices that perform heating on a hot plate. device etc. [0004] For example, Patent Document 1 discloses a vacuum press lamination molding apparatus. This vacuum press lamination molding device has upper and lower chambers. The lower chamber accommodates the molding base material, and a sheet can be placed near the peripheral portion of the upper chamber. The upper chamber has a heating plate with a heater above. The ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C51/12B29C51/10
CPCB29C51/10B29C51/12B29C51/02B29C51/165B29C51/20B29C51/36B29C2791/006B29C2791/007B29C2793/0009B29C2793/0027B29C2793/0081B29C2793/009B29C2795/002B29C51/14B29C51/261B29C51/425B29K2623/00B29C51/42
Inventor 寺本一典仁平政伸宇佐美秀树
Owner ASANO LABORATORIES CO LTD