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Adhesives for Inductors and Inductors

A technology of adhesives and inductors, applied in the field of inductors, can solve the problems of reduced yield, productivity and reliability, difficulty in controlling the thickness of the bonding part, and difficulty in uniform thickness of the bonding part, etc., to improve moisture resistance property, the effect of suppressing the decrease of adhesiveness

Active Publication Date: 2020-12-04
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using an adhesive that does not contain particles, it is difficult to control the thickness of the bonded part
Even if an adhesive containing particles such as glass beads is used, it is difficult to make the thickness of the bonded part uniform, and the yield, productivity, and reliability may decrease.

Method used

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  • Adhesives for Inductors and Inductors
  • Adhesives for Inductors and Inductors
  • Adhesives for Inductors and Inductors

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] (1) Preparation of adhesive for inductors

[0126]According to the composition in Table 1, various materials other than the spacer particles were stirred and mixed with a revolving rotary mixer to obtain an adhesive composition. According to the composition of Table 1, spacer particles were added to the obtained adhesive composition, and an adhesive for inductors was prepared by stirring and mixing with a revolution and rotation mixer.

[0127] (2) Manufacture of inductors

[0128] A 10mL syringe (manufactured by Musashi Engineering Co., Ltd.) was filled with the adhesive for the obtained inductor, and a precision nozzle (manufactured by Musashi Engineering Co., Ltd., manufactured by Musashi Engineering Co., Ltd., when the particle size of the spacer particles was less than 100 μm, the inner diameter of the nozzle tip was 0.3mm, When the spacer particle size is 100 μm or more, the inner diameter of the tip of the nozzle is 0.6 mm), using a dispensing device ("SHOT MAST...

Embodiment 2～16

[0131] (Examples 2-16, Comparative Examples 1-2)

[0132] The adhesive for inductors, inductors, and samples for evaluating moisture resistance were obtained in the same manner as in Example 1 except that the kinds and amounts of added components were changed as shown in Tables 1 and 2.

[0133] (evaluate)

[0134] (1) Viscosity

[0135] When the particle size of the spacer particles in the adhesive is 20 μm or less, use an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., "TVE22L") to measure the viscosity of the adhesive at 25°C under the conditions of 25°C and 5 rpm. Viscosity (η25).

[0136] When the particle size of the spacer particles in the adhesive exceeds 20 μm, the viscosity of the adhesive at 25° C. (η25 ).

[0137] (2) Coatability

[0138] Evaluation of applicability was performed using a dispensing device ("SHOT MASTER 300" manufactured by Musashi Engineering Co., Ltd.). Coating conditions were as follows: under spraying conditions (temperature 25° ...

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Abstract

The present invention provides an adhesive for an inductor that can improve moisture resistance and suppress a decrease in adhesiveness even when exposed to high humidity. The adhesive for inductors of the present invention contains a thermosetting compound, a thermosetting agent, an inorganic filler, and spacer particles. The spacer particles are resin particles or organic-inorganic hybrid particles. The average particle diameter of the spacer particles is 20 μm or more. 200 μm or less, the CV value of the particle diameter of the spacer particles is 10% or less, and the content of the inorganic filler in 100% by weight of the adhesive is greater than 30% by weight and less than 75% by weight.

Description

technical field [0001] The present invention relates to an adhesive for inductors, which is used for inductors. Moreover, this invention relates to the inductor which used the said adhesive agent for inductors. Background technique [0002] Inductors are used in electronic devices such as mobile phones, televisions, and digital cameras. Especially in inductors that handle large currents, core materials such as ferrite cores are placed across gaps. Conventionally, an adhesive containing no particles or an adhesive containing particles such as glass beads has been used in the gap (adhesion portion). However, when using an adhesive that does not contain particles, it is difficult to control the thickness of the bonded portion. Even if an adhesive containing particles such as glass beads is used, it is difficult to make the thickness of the bonded portion uniform, and yield, productivity, and reliability may decrease. [0003] As an example of the adhesive, the following Pat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/24C09J11/04C09J11/06C09J201/00H01F17/04H01F37/00
CPCC09J11/04C09J11/06C09J201/00H01F17/04H01F27/24H01F37/00C09J11/08C09J2301/312H01F30/00
Inventor 增井良平高桥骏介高桥英之
Owner SEKISUI CHEM CO LTD