Reflow oven and method for preventing deformation of substrate during reflow
A substrate deformation and reflow furnace technology, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problem that the chip area cannot be effectively pressed, so as to prevent substrate deformation, reduce manufacturing costs, and improve work. The effect of efficiency
Active Publication Date: 2018-08-03
NANTONG FUJITSU MICROELECTRONICS
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Problems solved by technology
Although this method of pressing with a magnetic carrier and a ferromagnetic cover is widely used, it has the following limitations in actual use: For example, the ferromagnetic cover can press the non-chip area on the substrate to improve the flatness , but it cannot effectively suppress the chip area on the substrate (that is, the mounting chip area)
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[0018] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.
[0019] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0020] Please refer to figure 1 , the present application provides a method for preventing substrate deformation during reflow, the method includes the following steps: a first air blow flows above the substrate 4, a second air blow flows below the substrate 4, and the flow rate of the second air ...
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The invention provides a reflow oven and a method for preventing deformation of a substrate during reflow. The method comprises the steps that first blown air flows over the substrate, second blown air flows below the substrate, and a flow velocity of the second blown air is greater than that of the first blown air. According to the reflow oven and the method for preventing deformation of the substrate during reflow, the first blown air flows over the substrate, the second blown air flows below the substrate, and the flow velocity of the second blown air is greater than that of the first blownair, thus the pressure above the substrate is greater than the pressure below the substrate, and further a downward pressure on the substrate exists during reflow, thereby realizing overall compression on the substrate and preventing deformation of the substrate.
Description
technical field [0001] The present disclosure generally relates to the technical field of semiconductor packaging, in particular to a reflow process, and in particular to a reflow oven and a method for preventing deformation of a substrate during reflow. Background technique [0002] The reflow process is a key process of the chip flip-chip packaging process, which mainly solders the chip on the substrate through a reflow furnace. The substrate is generally a multi-layer structure, and the materials of each layer of the substrate are different, and the thermal expansion coefficients of each material are also different, so that the substrate will be warped to a certain extent during the reflow process, and thus cannot maintain a flat state. Poor soldering such as virtual soldering is prone to occur between the chip and the substrate. [0003] At present, the mainstream method to solve the warping deformation of the substrate during reflow is to use a magnetic carrier and a f...
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IPC IPC(8): H01L21/60H01L21/67
CPCH01L21/67092H01L24/83H01L2224/83053H01L2224/8321
Inventor徐新华
OwnerNANTONG FUJITSU MICROELECTRONICS