Light emitting part, light emitting device and image forming device
A technology for light-emitting components and light-emitting devices, which can be applied to image communication, electrical recording technology using charge patterns, and equipment for electrical recording technology applying charge patterns, etc. , The effect of suppressing adverse effects and reducing the driving voltage
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no. 1 approach
[0050] (image forming apparatus 1)
[0051] figure 1 It is a diagram showing an example of the overall configuration of the image forming apparatus 1 to which the first embodiment is applied. figure 1 The illustrated image forming apparatus 1 is an image forming apparatus generally called a tandem type. The image forming apparatus 1 includes: an image forming processing unit 10 that forms an image corresponding to image data of each color; an image output control unit 30 that controls the image forming processing unit 10; and an image processing unit 40 that communicates with, for example, A personal computer (PC) 2 or an image reading device 3 is connected, and performs predetermined image processing on image data received from the PC 2 or the image reading device 3 .
[0052] The image forming processing section 10 includes image forming units 11Y, 11M, 11C, and 11K (referred to as image forming units 11 if not distinguished) arranged side by side at predetermined interval...
no. 2 approach
[0319] In the light-emitting chip C of the second embodiment, the light-emitting layer 87 of the light-emitting diode LED is sandwiched between two distributed Bragg reflector layers (DBR: Distributed Bragg Reflector) (hereinafter referred to as DBR layers). The DBR layer is formed by laminating multiple semiconductor layers having different refractive indices. Furthermore, the DBR layer is configured to reflect light from the light emitting diode LED.
[0320] The structure other than the island 301 in which the driving thyristor S and the light-emitting diode LED are stacked in the light-emitting chip C is the same as that of the first embodiment. Therefore, different parts will be described, and the description of the same parts will be omitted.
[0321] Figure 12 It is an enlarged cross-sectional view of an island 301 in which the drive thyristor S and the light-emitting diode LED are laminated in the light-emitting chip C according to the second embodiment.
[0322] I...
no. 3 approach
[0348] In the light-emitting chip C of the third embodiment, instead of the light-emitting diodes LED of the first and second embodiments, a laser diode is used as an example of a light-emitting element.
[0349] In addition, other than the light-emitting chip C, other structures are the same as those of the first embodiment. Therefore, the light-emitting chip C will be described, and the description of the same parts will be omitted.
[0350] Figure 15 It is an equivalent circuit diagram illustrating a circuit configuration of a light-emitting chip C mounted with a self-scanning light-emitting element array (SLED) of the third embodiment. In the first embodiment Figure 5 The light-emitting diodes LED1 to LED128 are changed to laser diodes LD1 to LD128 (when not distinguished, they are referred to as laser diodes LD). other structures with Figure 5 The same, so the description is omitted.
[0351] In addition, regarding the plan layout and cross-sectional views of the ...
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