A Broadband LTCC Interdigital Capacitor

Abstract

The invention discloses a wide-band LTCC finger capacitor, the LTCC finger capacitor includes a first capacitor layer, a second capacitor layer, a third capacitor layer and a fourth capacitor layer which are sequentially stacked, and the second The capacitor layer and the third capacitor layer are provided with the same number of fingers, and the first capacitor layer, the second capacitor layer, the third capacitor layer and the fourth capacitor layer are connected in cascade through vertical via holes, The first capacitor layer and the second capacitor layer are connected through the first connection mechanism and the second connection mechanism formed by the vertical via hole, and the second capacitor layer and the third capacitor layer are connected through the first connection mechanism formed by the vertical via hole. The three connection mechanisms are connected to the fourth connection mechanism, and the third capacitor layer and the fourth capacitor layer are connected through the fifth connection mechanism and the sixth connection mechanism formed by vertical via holes; the interdigitated capacitor proposed by the present invention has low preparation cost and the finished product It has the advantages of high efficiency, high reliability, high temperature resistance, and can be applied to harsh environments; at the same time, it realizes the miniaturization of capacitors.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a broadband LTCC (Low Temperature Co-fired Ceramic, low temperature co-fired ceramic) interdigital capacitor. Background technique [0002] Traditional interdigital capacitance (IDC) is often used to make lumped filters or couplers for multilayer substrates because of its large capacitance, high Q value, and small size; currently, the traditional interdigital capacitance is enhanced The way is to increase the size or number of fingers, but increasing the size of the fingers does not help reduce the size of the filter; and increasing the number of fingers leads to unwanted resonances at multiple frequency points, or spurious spurs spikes, thereby limiting its usable frequency band. [0003] Since the interdigital capacitor is a multi-conductor and multi-finger structure, it is easy to cause multiple passbands and stopbands in its equivalent circuit circuit during design and prod...

AI Technical Summary

Problems solved by technology

[0002] Traditional interdigital capacitance (IDC) is often used to make lumped filters or couplers for multilayer substrates because of its large capacitance, high Q value, and small size; currently, the traditional interdigital capacitance is enhanced The way is to increase the size or number of fingers, but increasing the size of the fingers does not help reduce the size of the filter; and increasing the number of fingers leads to unwanted resonances at multiple frequency points, or spurious spurs spikes, thereby limiting its usable frequency band

[0003] Since the interdigital capacitor is a multi-conductor and multi-finger structure, it is easy to cause multiple passbands and stopbands in its equivalent circuit circuit during design and production. At present, it is mainly connected by gold wire bonding without adjacent open circuits. However, this method is not suitable for interdigital capacitors because the fingers of traditional interdigital capacitors are packaged into multi-layer substrates; in addition, by designing vias and defect structures in interdigital capacitors It is beneficial to eliminate strays, but this makes the structure of the capacitor too complicated and difficult to process and manufacture

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