Method and system for dynamically controlling HTCC (high temperature co-fired ceramic) plate back epoxy resin glue quantity

Abstract

The invention relates to a method and system for dynamically controlling the HTCC (high temperature co-fired ceramic) plate back epoxy resin glue quantity. The method comprises the following steps that 1, square-shaped epoxy resin glue is dispensed at the HTCC plate back part by a glue dispensing controller; 2, the square-shaped epoxy resin glue is divided into eight (0 to 7) area regions; 3, theshot 0-7 area region and the corresponding standard 0-7 area regions are compared to obtain the area percent of each region; the average percent is obtained; 4, if the average percent is smaller than99 percent, a pressure boosting instrument is given out; if the average percent is greater than or equal to 99 percent but is smaller than or equal to 101 percent, the instrument is not given out; ifthe average percent is greater than 101 percent, a pressure reduction instrument is given out; 5, the air pressure value is updated for dynamically controlling the epoxy resin glue outlet quantity; the square-shaped epoxy resin glue is divided into the eight (0-7) area regions and is then compared with the standard image for comparison to obtain the average value. The epoxy resin glue area of eachregion of the glue dispensing route is comprehensively considered and analyzed; the accurate data support is provided for the subsequent product dynamic glue quantity control; poor phenomena such asglue overflow and camera lens falling are reduced.

Description

technical field [0001] The invention relates to the field of camera module production, in particular to a method and system for dynamically controlling the amount of epoxy resin on the back of an HTCC board. Background technique [0002] In the field of camera module production, the back of the HTCC board (high-temperature co-fired multilayer ceramic substrate) should be pre-coated with epoxy resin glue, and then the HTCC board and the lens will be glued and fixed together using the viscosity of the epoxy resin glue. Resin glue refers to the adhesive made of epoxy resin as the main body. This glue is characterized by strong versatility, waterproof, and oil resistance. It is often used when assembling lenses on HTCC boards. When epoxy resin glue is dispensed from the glue cartridge After arriving at the back of the HTCC board, the epoxy resin glue that has been glued is directly in contact with the air at room temperature. As time goes by, the epoxy resin glue will solidify a...

AI Technical Summary

Problems solved by technology

[0002] In the field of camera module production, the back of the HTCC board (high-temperature co-fired multilayer ceramic substrate) should be pre-coated with epoxy resin glue, and then the HTCC board and the lens will be glued and fixed together using the viscosity of the epoxy resin glue. Resin glue refers to the adhesive made of epoxy resin as the main body. This glue is characterized by strong versatility, waterproof, and oil resistance. It is often used when assembling lenses on HTCC boards. When epoxy resin glue is dispensed from the glue cartridge After arriving at the back of the HTCC board, the epoxy resin glue that has been glued is directly in contact with the air at room temperature. As time goes by, the epoxy resin glue will solidify and reduce its volume, which will affect the bonding performance. Therefore, it is required to dispense glue on the back of the HTCC board The speed must be very fast to reduce the impact on the normal assembly of the lens, but the actual production situation is that the amount of epoxy resin on the back of the HTCC board is sometimes more and sometimes less (too fast), and if the amount of epoxy resin is too much, it will be removed from the HTCC board. Overflow from the gap between the lens and the lens will not only affect the appearance but also reduce the performance and quality of the product. If the amount of epoxy resin is too small, it will not stick firmly. The HTCC board and the lens are easy to be separated and separated, and there is a risk of falling off. It is necessary to introduce a certain mechanism to detect and feed back the amount of epoxy resin glue dispensed for each HTCC board, so as to dynamically control the amount of epoxy resin glue dispensed, so that the amount of glue dispensed can meet the use requirements

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