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Photo-curing forming equipment based on DLP

A technology of light-curing molding and equipment, which is applied in metal processing equipment, 3D object support structures, additive manufacturing, etc., and can solve problems such as solid deformation

Inactive Publication Date: 2018-08-28
华明智库(武汉)信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of deformation of the processed entity due to the stress generated by the temperature change in the heat balance process after processing in the prior art, and propose a light-curing molding device based on DLP

Method used

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  • Photo-curing forming equipment based on DLP
  • Photo-curing forming equipment based on DLP
  • Photo-curing forming equipment based on DLP

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0024] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0025] refer to Figure ...

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Abstract

The invention discloses photo-curing forming equipment based on DLP. The photo-curing forming equipment comprises a base, a forming groove is formed above the base and is filled with liquid photosensitive resin, two symmetric first springs are connected between the forming groove and the base, two supporting plates are connected to the upper surface of the base in symmetry about the forming groove, a top plate is jointly connected to the upper ends of the supporting plates, an industrial control computer and a controller at one side of the industrial control computer are fixedly connected to the upper surface of the top plate, a DLP projection system is fixedly connected to the center of the lower surface of the top plate, and a lifting device is arranged at one side of the DLP projectingsystem and is fixedly connected to the lower surface of the top plate. The photo-curing forming equipment is simple in structure and convenient to operate, and the problems are solved that in the heatbalance process after machining, stress can be generated due to temperature change, the machined body deforms, and finally, the machining quality is influenced; moreover, the bad influence of vibration force on photo-curing forming is greatly lowered.

Description

technical field [0001] The invention relates to the technical field of rapid prototyping, in particular to a DLP-based photocuring molding device. Background technique [0002] Photocuring molding process is a kind of rapid prototyping process formed by using liquid photosensitive resin as raw material, using the polymerization reaction caused by photosensitive resin under the irradiation of light, and completing the curing mechanism. Fast, short production cycle, good prototype surface quality, high dimensional accuracy, and the ability to achieve relatively fine dimensional molding, etc., have been widely used in various manufacturing fields in recent years. [0003] As an important part of light curing technology, the mechanical processing part plays a key role in the processing efficiency and processing accuracy of the entire system. In the prior art, the processing temperature is higher than room temperature during the molding process, and stress will be generated due ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/129B29C64/20B33Y30/00F16F15/06
CPCB33Y30/00F16F15/06
Inventor 何丹
Owner 华明智库(武汉)信息技术有限公司