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Packaging method of organic light emitting diode device, packaging device and display substrate

A technology of light-emitting diodes and packaging methods, which is applied in the fields of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., and can solve the problems of easy overflow of materials and wide frame of display devices, etc.

Inactive Publication Date: 2018-08-28
YUNGU GUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, inkjet printing technology can be used to cover the encapsulation film on the OLED device, but when printing the encapsulation film, the material of the encapsulation film tends to overflow, therefore, the frame of the display device using the OLED device is wider

Method used

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  • Packaging method of organic light emitting diode device, packaging device and display substrate
  • Packaging method of organic light emitting diode device, packaging device and display substrate
  • Packaging method of organic light emitting diode device, packaging device and display substrate

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Embodiment Construction

[0042] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatuses and methods consistent with aspects of the invention as recited in the appended claims.

[0043] The encapsulation film of the OLED device can include an organic thin film layer and an inorganic thin film layer. The organic thin film layer covering the OLED device can be formed by inkjet printing. The inkjet printing method refers to printing a liquid organic material on the OLED device through inkjet equipment. After curing, an organic thin film layer is formed.

[0044] In the rel...

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PUM

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Abstract

The invention discloses a packaging method of an organic light emitting diode device, a packaging device of an organic light emitting diode device and an organic light emitting diode device display substrate. The packaging method includes the following steps that: the peripheral region of an organic light emitting diode device region is formed on a substrate, and a first organic material is printed and solidified so as to form a first organic thin film layer; and a second organic thin film layer covering the organic light emitting diode device region is formed in a region surrounded by the first organic thin film layer by means of printing. With the packaging method adopted, a frame width between the edge of the OLED device region and the edge of the substrate is small; and since the frameof a display device using the OLED device is narrow, and the requirements of a narrow-frame display device can be satisfied.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a packaging method and packaging equipment of an organic light emitting diode device, and a display substrate of the organic light emitting diode device. Background technique [0002] Organic Light Emitting Diode (OLED) is an active light-emitting device, which is widely used in display devices. [0003] Since OLED devices are sensitive to water and oxygen in the air, OLED devices need to be packaged. At present, thin film packaging can be used. After the OLED device is fabricated on the substrate, the packaging film is covered on the OLED device. The film blocks water, oxygen, etc., and improves the service life and brightness of OLED devices. [0004] Currently, inkjet printing technology can be used to cover the encapsulation film on the OLED device, but when the encapsulation film is printed, the material of the encapsulation film tends to overflow, therefore, the frame of ...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/844H10K71/00
Inventor 赵长征张鹏记陈浩王森
Owner YUNGU GUAN TECH CO LTD
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