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A kind of processing method of high-density wiring pcb
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A technology of high-density wiring and processing methods, which is applied in chemical/electrolytic methods to remove conductive materials, electrically connect printed components, printed circuits, etc. Effect
Active Publication Date: 2020-01-17
DONGGUAN SHENGYI ELECTRONICS
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[0005] The purpose of the present invention is to provide a high-density wiring PCB processing method to solve the problem of poor hole shape when using T-shaped cutters to segment the copper layer of the hole wall in the prior art
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Embodiment 1
[0043] see image 3 , the present embodiment provides a method for processing a high-density wiring PCB, comprising steps:
[0044] Step 101: Laminate a plurality of core boards to form a multi-layer board, open at least one first through hole on the multi-layer board, and perform copper plating on each first through hole, so that the inner wall of the first through hole forms a copper plate. layer, such as Figure 4 shown.
[0045] In this step, the number of layers and the manufacturing process of the multilayer board are not limited, and the number of the first through holes is also not limited.
[0046] Step 102, forming a resist layer on the inner wall of each first through hole, such as Figure 5 shown.
[0047] Wherein, the resist layer is a tin layer or a lead-tin layer.
[0048] Step 103, using a T-shaped cutter to remove part of the resist layer on the inner wall of each first through hole until the copper layer covered by this part of the resist layer is expose...
Embodiment 2
[0059] see Figure 9 , the present embodiment provides another PCB processing method of high-density wiring, comprising steps:
[0060] Step 201: Laminate a plurality of core boards to form a multi-layer board, open at least one first through hole on the multi-layer board, and perform copper plating on each first through hole, so that the inner wall of the first through hole forms a copper plate. layer.
[0061] Step 202, forming a resist layer on the inner wall of each first through hole.
[0062] Wherein, the resist layer is a tin layer or a lead-tin layer.
[0063] Step 203: Fix a cover plate on the surface of the multi-layer board, and at least one second through hole is opened on the cover plate, each second through hole corresponds to a position of a first through hole, and the position of the second through hole The aperture is smaller than the aperture of the corresponding first through hole, such as Figure 10 shown.
[0064] Specifically, the number of the secon...
Embodiment 3
[0076] Embodiment 3 provides a PCB, which is fabricated according to the method provided in Embodiment 1 or Embodiment 2.
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Abstract
The invention relates to the technical field of a PCB, and discloses a processing method of a PCB with high-density wire distribution, and the PCB. The processing method comprises the steps of formingat least one first through hole in a multi-layered board, and performing metallization of the first through hole; forming an anti-corrosion layer on the inner wall of the first through hole; adoptinga T-shaped cutter to remove a part of the anti-corrosion layer on the inner wall of the first through hole until a copper layer covered with the part of the anti-corrosion layer is exposed, and enabling the anti-corrosion layer on the inner wall of the first through hole to be cut into at least two sections in the axial direction of the first through hole, wherein the T-shaped cutter comprises connected cutter handles and a tool bit with a cutting blade on the side surface, and the width of the tool bit is greater than that of the cutter handles; removing the copper layer exposed from the inner wall of the first through hole; and removing the residual anti-corrosion layer on the inner wall of the first through hole. Compared with the prior art, direct contact between the T-shaped cutter and the inner wall of the first through hole can be avoided, so that scraping of the hole wall by the cutter handles of the T-shaped cutter and scraping of the base material by the tool bit can be prevented, and a high effect of the hole shape can be ensured.
Description
technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for processing a high-density wiring PCB. Background technique [0002] With the development of high-density integrated circuit technology and microelectronics technology, the volume of electronic products has become lighter, thinner and smaller. In the wiring design of multi-layer PCB, vias are used for network connections between different layers, and usually only one network connection layer is designed for one via. Since each via occupies a certain area on the PCB surface, the larger the PCB capacity, the more design networks, the more the number of via holes, and the larger the design area of the PCB surface, which cannot meet the requirements of thinner electronic products. Smaller requirements. [0003] In order to improve the wiring density, there is currently a solution: first extend the T-shaped cutter into the met...
Claims
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Application Information
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