Polycarbonate resin composition, molded body, and carrier tape

A technology of polycarbonate resin and composition, applied in the field of molded body, carrier tape, and polycarbonate resin composition, can solve the problems of thermal deterioration of resin, decrease of conductivity of molded body, etc. Decreased conductivity, effect of excellent appearance

Active Publication Date: 2018-08-31
SUMIKA POLYCARBONATE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, there may be a problem that the electrical conductivity of the molded product is significantly lowered due to factors such as thermal deterioration of the resin due to repeated melting and kneading, and aggregation of the conductive filler.

Method used

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  • Polycarbonate resin composition, molded body, and carrier tape
  • Polycarbonate resin composition, molded body, and carrier tape
  • Polycarbonate resin composition, molded body, and carrier tape

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0080] (Preparation method of resin composition)

[0081] The polycarbonate resin composition of the present embodiment can be obtained by mixing the constituent components. The method for mixing the constituent components of the polycarbonate resin composition of the present embodiment is not particularly limited, and for example, after mixing using an arbitrary mixer (drum mixer, ribbon mixer, high-speed mixer, etc.), A method of melt-kneading using an extruder or the like.

[0082]

[0083] The molded body (molded article) of the present embodiment contains the polycarbonate resin composition of the present embodiment. The molded body of the present embodiment may be in the form of a film or in the form of a flat plate. As a molded object of this embodiment, a film, an adhesive tape, a sheet, etc. are mentioned. As the molded body of the present embodiment, for example, a container for accommodating electronic components (for example, a container for transportation or ...

Embodiment

[0090] The present invention will be described below by way of examples, but the present invention is not limited by these examples.

[0091]

[0092] The additive components of the content shown in Tables 1-3 were prepared. Then, using a twin-screw extruder (manufactured by KOBESTEEL, LTD., KTX-37) having a diameter of 37 mm, the additive components were melt-kneaded at a barrel temperature of 280° C. to obtain various pellets.

[0093] The details of the additive components used are as follows.

[0094] [polycarbonate resin]

[0095] A-1: Polycarbonate resin synthesized from bisphenol A and phosgene, manufactured by Sumika Polycarbonate Ltd., CALIBRE 200-13 (viscosity average molecular weight: 21000)

[0096] [Polyalkylene terephthalate resin]

[0097] B-1: Polybutylene terephthalate resin, manufactured by Polyplastics Co., Ltd., Juranex 600FP (intrinsic viscosity: 1.0)

[0098] [carbon material]

[0099] C-1: Furnace carbon black, manufactured by Cabot Corporation, V...

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Abstract

A polycarbonate resin composition which includes a polycarbonate resin, a polyalkylene terephthalate resin, a carbon material, and a graft copolymer, the graft copolymer having a structure that includes a core and a covering portion that covers at least a portion of the core, the content of the carbon material being 10 to 45 parts by mass with respect to 100 parts by mass of the total of the polycarbonate resin and the polyalkylene terephthalate resin, and the content of the graft copolymer being 0.5 to 35 parts by mass with respect to 100 parts by mass of the total of the polycarbonate resinand the polyalkylene terephthalate resin.

Description

technical field [0001] The present invention relates to a polycarbonate resin composition, molded body and carrier tape. Background technique [0002] When dust or garbage adheres to electronic components such as integrated circuit chips (IC chips), it can cause accidents such as malfunctions. Therefore, when electronic components are used, synthetic resin carrier tapes in which recesses called pockets are arranged at regular intervals on a long sheet of arbitrary width are used as containers for transporting or storing electronic components. [0003] At this time, the electronic components are housed in the pocket. And, a carrier body is obtained by covering with a film called a cover tape. The carrier tape is conveyed, stored, etc. in a state wound up into a reel. After peeling off the cover tape from the carrier tape, the electronic component is taken out from the pocket and used. Mounting machines are also sometimes used to automatically remove electronic components....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08K3/04C08L51/06C08L67/03
CPCC08K3/04C08L51/06C08L67/03C08L69/00C08L53/00C08L67/06
Inventor 谷村博之
Owner SUMIKA POLYCARBONATE LTD
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