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Low-temperature curing SMT (Surface Mount Technology) red glue

A patch red and low temperature technology, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of high energy consumption, adverse effects on performance, and increased enterprise costs, so as to achieve guaranteed performance, good energy reduction, and The effect of reducing production costs

Inactive Publication Date: 2018-09-04
苏州盛威佳鸿电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the miniaturization of electronic appliances, high temperature curing will adversely affect the performance of some components, and the energy consumption is also high, which increases the cost of the enterprise. Therefore, it is urgent to develop a patch red glue suitable for low temperature curing.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Weighing: 26 kg of low-temperature epoxy resin, 10 kg of sorbitol polyglycidyl ether, 17 kg of triphenyl phosphite, 1.1 kg of konjac gum, 1.8 kg of attapulgite, 1.9 kg of diluent, 5.6 kg of accelerator, coupling 2.3 kilograms of agent and 1.1 kilograms of pigments, make the low-temperature curing paster red glue of the present invention.

Embodiment 2

[0017] Weighing: 28 kg of low-temperature epoxy resin, 11 kg of sorbitol polyglycidyl ether, 18 kg of triphenyl phosphite, 1.4 kg of konjac gum, 2.1 kg of attapulgite, 2.2 kg of diluent, 5.9 kg of accelerator, coupling 2.5 kilograms of agent and 1.2 kilograms of pigments, make the low-temperature curing paster red glue of the present invention.

Embodiment 3

[0019] Weighing: 29 kg of low-temperature epoxy resin, 12 kg of sorbitol polyglycidyl ether, 19 kg of triphenyl phosphite, 1.5 kg of konjac gum, 2.5 kg of attapulgite, 2.3 kg of diluent, 6.3 kg of accelerator, coupling 2.8 kilograms of agent and 1.3 kilograms of pigments, make the low-temperature curing paster red glue of the present invention.

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PUM

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Abstract

The invention discloses a low-temperature curing SMT (Surface Mount Technology) red glue. The low-temperature curing SMT red glue is prepared from the following components in parts by weight: 26 to 35parts of low-temperature epoxy resin, 10 to 16 parts of sorbitol polyglycidyl ether, 17 to 25 parts of triphenyl phosphite, 1.1 to 2.2 parts of konjac glucomannan, 1.8 to 3.5 parts of attapulgite, 1.9 to 2.6 parts of diluent, 5.6 to 7.9 parts of accelerant, 2.3 to 3.4 parts of coupler and 1.1 to 1.8 parts of pigment. Through the way, the low-temperature curing SMT red glue provided by the invention can be quickly cured under a low-temperature environment, the performance of components can be ensured, energy consumption is reduced, and the production cost of an enterprise is reduced.

Description

technical field [0001] The invention relates to the field of adhesives for electronics, in particular to a low-temperature curing patch red glue. Background technique [0002] Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram, so all kinds of electrical appliances need various SMT stickers. [0003] Sheet glue for bonding. [0004] Most of the patch red glue on the market has a curing temperature of about 150°C, and a curing time ranging from 2 to 5 minutes. With the miniaturization of electronic appliances, high-temperature curing will adversely affect the performance of some components, and the energy consumption is also high, which increases the cost of the enterprise. Therefore, it is urgent to develop a patch red glue suitable for low-temperature curing. Contents of the invention [0005] The technical problem mainly solved by the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C09J11/06
CPCC08L2205/03C09J11/04C09J11/06C09J11/08C09J163/00C08L71/02C08L5/00C08K13/02C08K3/346C08K5/526
Inventor 朱道田
Owner 苏州盛威佳鸿电子科技有限公司