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In-place-packaged integrated circuit support structure and manufacturing method thereof

A support structure and integrated circuit technology, applied in the direction of circuit, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as detachment, chip and support separation, inclination, etc., to achieve accurate positioning direction, chip end flat, stable welding Effect

Active Publication Date: 2018-09-04
昆山市品能精密电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the problem of degumming between the terminal and the plastic after bending, the PIN will be detached. During the use of the sensor, the lead pins of the sensor need to be soldered and soldered on the circuit board for use, because the chip needs to be bonded with the bonding wire. The convex hull of the bonding wire is usually directly connected to the chip. During the subsequent sealing process, the chip will be unstable in the bracket, causing problems such as tilting and unstable connection of the bonding wire, resulting in the separation of the chip and the bracket, and the failure of the entire integrated circuit. Work

Method used

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  • In-place-packaged integrated circuit support structure and manufacturing method thereof

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Embodiment

[0025] refer to figure 1 As shown, this embodiment is an integrated circuit support structure packaged in place, including a support body and several groups of PAD regions 2 arranged in the support body;

[0026] The bracket body includes a first bracket 1 and a second bracket 11 arranged in parallel, and the ends of the first bracket 1 and the second bracket 11 are respectively connected to form a frame structure.

[0027] The first bracket 1 and the second bracket 11 are provided with several groups of symmetrically arranged PAD regions 2 , and in this embodiment, there are three groups of PAD regions 2 , and the number of each group is two.

[0028] A connecting frame 12 is arranged between the first bracket 1 and the second bracket 11 , and the connecting frame 12 is arranged parallel to the first bracket 1 ; the two sides of the connecting frame 12 are respectively provided with PAD areas 2 .

[0029] The PAD area 2 includes a connection part 21, several sets of welding ...

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Abstract

The present invention discloses an in-place-packaged integrated circuit support structure. The structure comprises a support body and a plurality of sets of PAD regions disposed in the support body; the support body includes a first bracket and a second bracket; a connecting frame is disposed between the first bracket and the second bracket; the PAD areas are arranged at two sides of the connecting frame; the PAD area includes a connecting portion, and a plurality of sets of welding portions symmetrically disposed at two sides of the connecting portion; and one end of the connecting portion isconnected with the connecting frame, and the other end of the connecting portion is connected with the first bracket or the second bracket, the joints of the welding portions and connecting portion are provided with bent portions; end portions of the welding portions are provided with welding convex hulls; the first bracket is provided with supporting portions; and the heights of the supporting portions are matched with the heights of the bends of the welding portions. With the in-place-packaged integrated circuit support structure of the invention adopted, the in-place bonding of chips and die-bonding welding wires is realized, and package is stable.

Description

technical field [0001] The invention belongs to the technical field of integrated circuits, and in particular relates to an integrated circuit support structure packaged in place and a manufacturing method thereof. Background technique [0002] The center of the integrated circuit bracket is the PAD functional area. During use, it needs to be connected to the chip by bonding wires, PIN of the terminal to connect the chip and sealant. Due to the problem of degumming between the terminal and the plastic after bending, the PIN will be detached. During the use of the sensor, the lead pins of the sensor need to be soldered and soldered on the circuit board for use, because the chip needs to be bonded with the bonding wire. The convex hull of the bonding wire is usually directly connected to the chip. During the subsequent sealing process, the chip will be unstable in the bracket, causing problems such as tilting and unstable connection of the bonding wire, resulting in the separa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48H01L21/50
CPCH01L21/4821H01L21/50H01L23/49503H01L23/49541
Inventor 刘正伟
Owner 昆山市品能精密电子有限公司
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