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Heat dissipation device

A technology of a heat sink and heat sink, which is applied in the direction of modification, cooling/ventilation/heating transformation, and electrical components through conduction and heat transfer. simple effect

Active Publication Date: 2018-09-04
王彦宸 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the heat dissipation method of the semiconductor refrigeration sheet is: placing the semiconductor refrigeration sheet in the air to dissipate heat freely, and the heat dissipation efficiency is low

Method used

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Embodiment 1

[0024] figure 1 A schematic structural diagram of a heat dissipation device according to an embodiment of the present invention is shown, figure 2 show figure 1 Sectional view of A-A in the middle. Such as Figure 1-2 As shown, the heat dissipation device provided by the embodiment of the present invention includes: a conduction rod 2 and a heat dissipation part 1 , and the conduction rod 2 supports the heat dissipation part 1 and transfers heat of an object to be dissipated to the heat dissipation part 1 .

[0025] The heat dissipation part 1 includes a plurality of heat dissipation fins 11 arranged in parallel with gaps between adjacent heat dissipation fins 11 , and the conductive rods 2 pass through the plurality of heat dissipation fins 11 in sequence and are connected to the plurality of heat dissipation fins 11 .

[0026] Now take the semiconductor cooling chip as an example to illustrate the working process of the heat dissipation device.

[0027] When the heat si...

Embodiment 2

[0030] On the basis of the first embodiment above, optionally, as figure 1 As shown, the distances between adjacent heat sinks 11 are equal to facilitate the manufacture of the heat sink 1 and reduce the cost.

[0031] exist figure 1 In the embodiment, the heat sink 11 is made of aluminum alloy, which can reduce the weight of the heat sink 1 while ensuring the heat dissipation efficiency, so that the conductive rod 2 can better support the heat sink 1 .

[0032] Preferably, the thickness of the heat sink 11 is about 0.35 mm, and the distance between adjacent heat sinks 11 is about 1.5 mm, which further reduces the volume of the heat sink 1 and facilitates installation.

[0033] Preferably, the number of conductive rods 2 is multiple, and the multiple conductive rods 2 are arranged in parallel to better support the heat dissipation part 1, transfer heat faster, and improve heat dissipation efficiency.

[0034] Further, the conduction rod 2 is roughly in the shape of a U-shape...

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Abstract

The embodiment of the invention discloses a heat dissipation device. The heat dissipation device comprises conduction bars and a heat dissipation part, wherein the conduction bars are used for supporting the heat dissipation part and are used for transferring heat of a to-be-heat-dissipated object to the heat dissipation part; and the heat dissipation part comprises a plurality of heat dissipationpieces which are arranged in parallel, a gap is formed between each two heat dissipation pieces, the conduction bars sequentially penetrate through the heat dissipation pieces and are fixedly connected with the heat dissipation pieces. By utilizing the embodiment of the invention, the heat dissipation area of a heating end of a semiconductor refrigeration piece can be greatly increased, so that the heat dissipation efficiency is improved; and furthermore, the heat dissipation device is simple in structure, very convenient to use and replace and low in heat dissipation cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor refrigeration chips, in particular to a heat dissipation device. Background technique [0002] The semiconductor refrigeration sheet is connected by N-type semiconductor material and P-type semiconductor material to form a galvanic pair. When the semiconductor refrigeration sheet is connected to a direct current, the current flows from the N-type element to the joint of the P-type element to absorb heat and become a cooling terminal; The component flows to the joint of the N-type component to release heat and become the heating end. At present, the heat dissipation method of the semiconductor cooling chip is: the semiconductor cooling chip is placed in the air to freely dissipate heat, and the heat dissipation efficiency is low. Contents of the invention [0003] In view of this, an embodiment of the present invention proposes a heat dissipation device to solve the above technical problem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145H05K7/2039
Inventor 阚立刚王彦宸
Owner 王彦宸
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