A lead frame redistribution structure and its manufacturing method
A technology of redistribution structure and manufacturing method, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of waste of lead frame material, unfavorable rewiring, and unfavorable reinterconnection of leadframes. , to achieve the effect of simple and reliable cost, preventing unreliability and saving cost
Active Publication Date: 2020-07-31
台州市广源文具有限公司
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Problems solved by technology
[0002] Existing lead frame packages mostly adopt a pre-formed lead frame structure, which is not conducive to subsequent re-interconnection, and often requires additional intermediary boards or PCB boards to form interconnections
E.g figure 1 In the above, the lead frame includes the base body 1 and the pin 2, which are encapsulated by the resin 5, and when the two pins 2a and 2b in the pin need to be connected, the interconnection structure 2c is usually formed when the lead frame is manufactured , which is not conducive to subsequent rewiring, and wastes lead frame material
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[0033] see Figure 2-6 , the lead frame redistribution structure of the present invention, which includes:
[0034] A lead frame, which includes a base body 1 and a plurality of mutually independent pins 2 of the same shape surrounding the base body 1;
[0035] A first chip 3a and a second chip 3b, the first chip 3a and the second chip 3b are located on the substrate 1 and electrically connected to the plurality of pins 2 through a plurality of leads 4 respectively;
[0036] a first resin layer 5a containing an activatable metal complex, which seals the substrate 1, the first chip 3a, and the second chip 3b and seals a portion of each of the plurality of pins 2;
[0037] The redistribution layer 6 is a metal layer obtained by laser activating the activatable metal complex in the first resin layer 5a, the redistribution layer 6 is embedded in the first resin layer 5a and is connected to the first resin layer 5a. The surface of a resin layer 5a is flush, wherein the redistribu...
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The invention provides a lead frame redistribution structure and a manufacturing method thereof. Flexible redistribution and interconnection of pins meeting various different requirements can be achieved by using a redistribution layer outside a first packaging layer; the redistribution layer is formed by using a laser activation method, so that the method is simple, reliable and cost-saving; theunreliability of redistribution caused by further activation of the activable metal complex in latter long-term use can be avoided by a light shield.
Description
technical field [0001] The invention relates to the field of chip interconnection packaging, in particular to a lead frame redistribution structure and a manufacturing method thereof. Background technique [0002] Existing lead frame packages mostly adopt a pre-formed lead frame structure. The predetermined lead frame is not conducive to subsequent re-interconnection, and an additional intermediary board or PCB board is often required to form the re-interconnection. For example figure 1 In the above, the lead frame includes the base body 1 and the pin 2, which are encapsulated by the resin 5, and when the two pins 2a and 2b in the pin need to be connected, the interconnection structure 2c is usually formed when the lead frame is manufactured , which is not conducive to subsequent rewiring and wastes lead frame materials. Contents of the invention [0003] Based on solving the above problems, the present invention provides a lead frame redistribution structure, which incl...
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IPC IPC(8): H01L23/495H01L21/60
CPCH01L23/49541H01L24/83H01L24/85H01L2224/0231H01L2224/02331H01L2224/832H01L2224/852H01L2224/48091H01L2924/00014
Inventor 韩德军
Owner 台州市广源文具有限公司