231results about How to "Interconnection" patented technology

The invention relates to the field of human health influence factor detection instruments, in particular to a wrist watch device with an intelligent health monitoring and alarming system and a method thereof. The wrist watch device comprises a wrist watch shell and a watch strap. A circuit of the intelligent health monitoring and alarming system is arranged in the cavity of the wrist watch shell, a display screen and an environment temperature infrared sensor are arranged on the face of the shell, an LED blood flow velocity acceleration sensor, an infrared body temperature sensor and a humidity sensor are equidistantly arranged in the middle of the bottom of the shell, and connection watch strap lugs are arranged on the left side and the right side of the shell. Wire connection terminals are arranged on the connection watch strap lugs. Ceramic pressure sensors are adopted as pulse sensors, installed at the contact portion of the bottom of the watch strap and the wrist of the human body and equidistantly arranged on the bottom of the watch strap in the vertical direction. Keys are arranged on the upper side of the shell. The wrist watch device with the intelligent health monitoring and alarming system and the method thereof have the advantages that the sensors and a single-chip microcomputer control the circuit to monitor various health indexes of users in real time, results are displayed through the display screen, and information is fed back to the users.

The present invention relates to an LCP substrate-based encapsulation shell and a preparation method. The encapsulation shell comprises a metal enclosure, a LCP substrate composite layer which is arranged below the metal enclosure, and a metal cover plate which covers the metal enclosure; a plurality of LCP substrates which are connected with one another and are laminated so as to form the LCP substrate composite layer; the metal enclosure is in airtight connection with the LCP substrate composite layer; the metal cover plate is in airtight connection with the metal enclosure; the LCP substrate composite layer includes a chip adhesive layer, a gold wire bonding layer, components and a metal enclosure welding layer which are connected with one another sequentially; through holes are formed in the metal enclosure welding layer, so that excellent grounding and space isolation are realized; and electroplated solid holes are formed in each layer of the LCP substrate composite layer, so that electrical connection between any layers can be realized. The shell of the invention has the advantages of high air tightness, small size and light weight, and can be applied to high-frequency integrated circuits such as microwave and millimeter wave integrated circuits.

The invention discloses a multi-agent and heterogeneous communication technology based micro-grid intelligent measuring and controlling terminal, a multi-agent system and a measuring and controlling method of the multi-agent system. An element Agent, a micro-grid Agent and an upper-stage power grid Agent form a micro-grid multi-agent system. The intelligent measuring and controlling terminal comprises a master control module, a data acquisition module, a protection control output module and a heterogeneous communication module. The data acquisition module acquires real-time data information of base layer elements in the micro grid, the master control module stores and processes the real-time data information and sends the real-time data information to an upper micro-grid Agent through the heterogeneous communication module. Meanwhile, the master control module receives control instructions of the micro-grid Agent through the heterogeneous communication module and transmits the control instructions to the base layer elements in the micro grid through the protection control output module to control the work states of the elements. The intelligent measuring and controlling terminal and method have the advantages of being capable of achieving mutual communication of micro-grid complex heterogeneous communication networks, wireless, small in size, low in power consumption, low in cost and capable of improving the micro-grid safe and stable operation and power generation efficiency greatly.

The invention discloses a protective plate for a series lithium battery pack based on a battery protective chip. The protective plate comprises a plurality of single lithium battery protective modules, a low battery warning signal driving circuit, a discharging protective signal driving circuit and a charging protective signal driving circuit; each lithium battery in the series lithium battery is correspondingly provided with a lithium battery protective module; the single lithium battery protective module comprises a first battery protective chip and a second battery protective chip; the first and second battery protective chips are used for realizing controlling charging and discharging through monitoring the battery voltage connecting the positive power supply input terminal and the negative power supply input terminal, and overcurrent detecting the voltage difference between the terminal and the terminal of the negative power supply input terminal; and the single lithium battery protective module corresponding to the single lithium battery at the negative end of the battery pack further detects whether the loop of the overall battery pack is in overcurrent or short circuit through a current sampling resistor. The protective plate provided by the invention has the functions of high voltage protection, low battery warning, low voltage protection, short circuit protection and the like.

Crystal growth performed in situ facilitates interconnection of prefabricated nano-structures. The nano-structures are immersed in a growth solution having a controllable saturation condition. Changing the saturation condition of the solution modifies a size of the immersed nanowires. The solution includes a solute of a nano-structure precursor material. The saturation condition is changed to one or both etch material from a surface of the nano-structures and initiate crystal growth on the nano-structure surface. A nano-structure interconnection system includes the growth solution and equipment to deposit the prefabricated nano-structures on a substrate. An interconnected structure includes a plurality of nano-structures disposed on a substrate in a cluster and a liquid phase-grown crystal lattice on surfaces of the nano-structures to form physical interconnections between the plurality. An ink formulation includes the plurality of nano-structures suspended in the growth solution.

The invention provides a tin-radical welding flux / copper particle composite welding flux capable of forming high-temperature welding spots rapidly at a low temperature. The tin-radical welding flux / copper-particle composite welding flux is composed of tin-radical welding flux powder, copper particle powder and welding paste, wherein the weight ratio of the tin-radical welding flux powder and the copper-particle powder lies between 5:2 and 2:3, the weight ratio of the remaining welding paste is 4%-20%, the particle size of the tin-radical welding flux powder is preferentially from 5 micrometers to 60 micrometers, and the particle size of the copper particle powder is from 0.1 micrometer to 10 micrometers. By means of the tin-radical welding flux / copper particle composite welding flux, the characteristics of a low melting point of the tin-radical welding flux and good wetting reaction of tin-copper are utilized, the high-melting intermetallic compound (IMC) interconnection welding spots can be formed within a short moment at the low temperature and without any pressure, and the tin-radical welding flux / copper particle composite welding flux is applicable to leading wire interconnection of electronic devices when a high temperature is caused during the service process or which performs the service at the high temperature. According to the tin-radical welding flux / copper particle composite welding flux capable of forming the high-temperature welding spots rapidly at the low temperature, the technology is simple, the cost is low, the practicability is great, and the problems of high cost, long welding time and high welding temperatures in existing chip packaging materials are solved.

The invention provides a topology construction method and a topology construction device supporting the layer 2 interconnection of data centers. The method comprises that: when online, a current site is registered in a neighbor server, acquires the information of each registered site and generates virtual bridging ports corresponding to each registered site; after being registered in the neighbor server, the current site acquires the information of all the newly registered sites according to preset rules, and generates the virtual bridging ports corresponding to each newly registered site; and the current site establishes channels with each registered site by the virtual bridging ports corresponding to each registered site for data transmission. By the method and the device, the sites can be automatically discovered.

The invention relates to a method for route transmission and address conversion of network message based on IPSec security association, which combines the address conversion of a network message, route transmission and IPSec processing together. The method is implemented by a gateway system that connects a local network and an external network and processes the network data stream that goes through the gateway system in one of three types of modes. In an IPSec route transmission mode, the gateway system determines destination (the local network) node and the route of the entry network message according to whether the network message is the IPSec message or the security association used by the IPSec message, and then the gateway system transmits the network message to the destination node; in an IPSec processing and route mode, the gateway system carries out IPSec processing to exit and entry messages as well as route transmission of the entry message based on the security association; and compared with the IPSec processing and route mode, in an IPSec route and address conversion mode, a step of network address conversion is added.

The invention discloses a method for interconnecting domains of a transparent interconnection over lots of links (TRILL) network. The method comprises the following steps that: the network is divided into different TRILL domains; a border Rbridge (BRB) in each TRILL domain informs an Rbridge of a local TRILL domain about the position information of a remote-end TRILL domain and the position information of a brother TRILL domain; when detecting that a destination media access control (MAC) address of a data frame is not in the local TRILL domain and the remote-end TRILL domain, the BRB packages the position information of the local TRILL domain into the data frame, and transmits the data frame to the remote-end TRILL domain; and when detecting that the destination MAC address of the data frame is in the local TRILL domain or the remote-end TRILL domain, the BRB transmits the data frame to an Rbridge corresponding to the destination MAC address. The invention also discloses a system for interconnecting the domains of the TRILL network. Due to the adoption of the scheme, the domain-based management of the TRILL network can be realized, and the problem of massive MAC information during the interconnection of a great number of TRILL domains is solved.

An embodiment of the invention relates to a data packet processing method and device. The method includes the steps: receiving a data packet forwarded by a source virtual switch and transmitted by a source virtual machine by a source controller; recognizing whether a TP (teleprocessing) address is stored in an address list or not by the source controller; determining that an objective virtual machine is not positioned in a source data center by the source controller if the TP address is not stored in the address list; determining first forwarding rules for forwarding the data packet to the objective virtual machine by the source controller; respectively transmitting the first forwarding rules to the source virtual switch and a source virtual proxy by the source controller, accordingly, forwarding the data packet to the source virtual proxy according to the first forwarding rules by the source virtual switch, and forwarding the data packet to an objective data center of the objective virtual machine according to the e first forwarding rules and a stored route forwarding table by the source virtual proxy. The source controller, the source virtual switch, the source virtual machine and the source virtual proxy are positioned at the source data center.

The invention provides a pressure sensor encapsulation structure containing silicon through holes, which uses a silicon base to substitute a traditional boron-phosphorosilicate glass base, and adopts a flip chip bonding technology and a bonding technology (such as CuSn bonding, AuSn eutectic bonding, Cu-Cu bonding and Au-Au bonding) to realize the airtight vacuum encapsulation of pressure sensors; a monocycle or bi-cycle bonding metal ring is adopted for encapsulation, and plays the role of reducing the bonding stress on the encapsulation of the pressure sensors with different piezoresistance strip distribution under the condition of ensuring the measurement sensitivity; and conductive columns are adopted for replacing metal wires to be used as signal lead wires, so the mutual connection reliability is increased. Compared with encapsulation structures of the silicon glass electrostatic bonding technology, the metal wire bonding technology, the metal isolating membrane technology and the airtight cavity silicone oil filling technology which are adopted traditionally, the pressure sensor encapsulation structure cancelled silicone oil filling and the metal isolating membrane, contributes to the improvement in the pressure sensor sensitivity, can also be used for dynamic pressure detection, and has the advantages of small size and high integration level.

The invention discloses an electromobile power platform system with integrative control, which comprises a power battery pack, a battery guard plate, a motor controller and a motor, The motor is connected with the motor controller through a motor three-phase power line, a motor speed signal line and a motor control signal line; the motor controller is connected with a positive electrode and a negative electrode of the power battery pack; and the battery guard plate is connected with the motor controller through a low electric quantity alarming signal line, a low voltage protecting signal line and a high voltage protecting signal line for sending low electric quantity alarming signals, low voltage protecting signals and high voltage protecting switch signals to the motor controller. According to the electromobile, the motor controller provides charging protection and discharging protection for the power battery pack, so as to overcome the problem of damage on the battery guard plate and the motor controller by surge current formed due to the fact that the battery guard plate suddenly powers off to protect the power battery pack, the efficiency and the reliability of the system are improved and the cost is reduced.

A semiconductor device is provided with a first wiring (110) between chips, for electrically connecting a first semiconductor chip with a second semiconductor chip; an auxiliary second wiring (120) between chips; a test signal generating circuit (4) for transmitting a test signal from the first semiconductor chip to the second semiconductor chip through the first wiring; a judging circuit (8), which outputs a first control signal in the case of receiving the test signal through the first wiring, and outputs a second control signal, i.e., the inversion signal of the first control signal, in the case of not receiving the test signal; and switching circuits (5, 6), which set the first wiring as a channel when the first control signal is inputted from the judging circuit, and set the second wiring when the second control signal is inputted.

The invention discloses a method and a system for realizing printing of a mobile device. The method comprises the following steps of: monitoring a broadcast message of a printing request by installing monitoring software at a computer; when the mobile device needs to print, transmitting the broadcast message of the printing request to a local area network; when the printing request is monitored by a computer, transmitting all the currently-connected printer messages to the mobile device; selecting one printer from all printers by the mobile device, building connection with the computer, and transmitting the selected printer, printing documents and setting printing parameters to the computer; and after the parameters are received by the computer, connecting the printer selected by the mobile device, and setting and printing the printing documents according to the printing parameters. According to the invention, the monitoring and the interlinking of the computer and the mobile device in a local area network are realized, the printing request of the mobile device is monitored by the computer, the printing task of the mobile device is completed, and the printing of the mobile device is realized without needing to purchase new equipment, so that the cost can be saved.

The invention discloses a system for cross backup of telemetering and digital transmission data channels for aerospace applications. The system comprises an integrated electronic subsystem, a spaceborne measurement control transponder, a digital transmission subsystem and spaceborne data equipment which are locally arranged on a satellite platform, wherein data transmission channels exist between the spaceborne data equipment and the integrated electronic sub-system and the digital transmission subsystem, and a data transmission channel is established between the integrated electronic sub-system and the digital transmission subsystem through the spaceborne data equipment to achieve the interconnection and multiplexing between a telemetering data download channel and a digital transmission data download channel; the spaceborne data equipment achieves the exchange of the telemetering / remote control data through a measurement control channel and the integrated electronic subsystem, unidirectionally transmits the large-capacity test data to the digital transmission subsystem at high speed through an LVDS data interface, and also achieves a two-way data connection through an RS-422 data interface and the digital transmission subsystem. According to the system disclosed by the invention, the advantages of the telemetering channel and the digital transmission channel are fully combined, the advantage complementation and cross backup of the telemetering channel and the digital transmission channel can be achieved, and the real-time performance and security of the data can be increased.

The invention provides an energy management system for a ship. The energy management system for the ship mainly comprises a power supply and distribution management module, a load management module, a security management module, a system analysis module, an information network management module and the like. The energy management system can effectively and rapidly dispatch electric energy and reasonably distribute and use electric energy according to operating conditions of the ship, can effectively manage the electric energy and power utilization conditions of various loads of the whole ship, so shat short supply, surplus and delayed distribution of electric energy of a power supply system are avoided to the greatest extent; and simultaneously, interconnection and intercommunication of a control network and an information network of the ship can be conveniently achieved in a flattening ship control network form due to the usage of an industrial Ethernet, seamless combination of high-level business information with ship automation can be completed, so that a totally open ship network system structure is formed in a real sense.

Crystal growth performed in situ facilitates interconnection of prefabricated nano-structures. The nano-structures are immersed in a growth solution having a controllable saturation condition. Changing the saturation condition of the solution modifies a size of the immersed nanowires. The solution includes a solute of a nano-structure precursor material. The saturation condition is changed to one or both etch material from a surface of the nano-structures and initiate crystal growth on the nano-structure surface. A nano-structure interconnection system includes the growth solution and equipment to deposit the prefabricated nano-structures on a substrate. An interconnected structure includes a plurality of nano-structures disposed on a substrate in a cluster and a liquid phase-grown crystal lattice on surfaces of the nano-structures to form physical interconnections between the plurality. An ink formulation includes the plurality of nano-structures suspended in the growth solution.

The embodiment of the invention provides an interlinking method as well as a message interlinking gateway among message systems. Under the condition that an SIP message system sends out message to a non-SIP message system, the message first passes through a MSRP( message session relay protocol) channel which is between the SIP message system and the message interlinking gateway, then the message is sent out to the message interlinking gateway, and then the message is sent out to the non-SIP message system by the message interlinking gateway; under the condition that the non-SIP message system sends out the message to the SIP message system, the message is firstly sent out to the message interlinking gateway, then the message interlinking gateway sends out the message to the SIP message system through the MSRP channel. As the MSRP channel which is between the SIP message system and the message interlinking gateway can transmit the message which is larger or smaller, thereby adopting the interlinking method as well as the message interlinking gateway among the message systems provided by the invention can realize the interlinking between the SIP message system and the non-SIP message system.

A data processing node, system and method is disclosed by the embodiments of the present invention which relates to the computer field and enables the flexible extension of the computer system. Said data processing node includes multiple Central Processing Units (CPUs), each CPU including multiple interconnect interfaces. Said CPUs are fully connected through the interconnect interfaces to form a CPU module. At least one interconnect interface is reserved in said CPU module to connect with the inner interconnect interface of an interconnect board. The interconnect board includes at least one outer interconnect interface which is used for connecting with the outer interconnect interfaces of the interconnect boards of other data processing nodes. The invention can be applied in the computer field.

The invention discloses a multi-FPGA chip accelerator card. The chip accelerator card comprises a PCIE switch chip, a PCIE bus and FPGA chips, wherein the PCIE switch chip is connected to the at least one FPGA chip through the PCIE bus; the FPGA chips are connected to SODIMM slot connectors; the PCIE switch chip is further connected to a gold finger and an IO Bridge chip through the PCIE bus; an IO Bus and IO connectors are arranged on the IO Bridge chip, and the IO Bridge chip is connected to the at least one IO connector through the IO Bus; and a power switch is connected to the gold finger, and a power connector and a power conversion circuit are connected to two ends of the power switch respectively . Through the multi-FPGA chip accelerator card disclosed by the invention, the computing capacity of a system is greatly improved when same system resources are occupied.

The invention is applicable to the field of circuit board connection structures and discloses a circuit board connection structure which comprises a secondary board and at least two main boards arranged in a stacking mode. Electric connectors are fixedly arranged on the main boards, and the secondary board and the electric connectors on the at least two main boards are connected. According to the circuit board connection structure, a plurality of circuit boards are stacked on three-dimensional space, and the limit that the circuit boards are arranged on two-dimensional plane is broken through so that intersystem interconnection is achieved, and a large quantity of signals is communicated; the number of layers of printed circuit boards (PCBs) is small, the external sizes are reduced, the sizes of a single main board and a single secondary board are small, wiring layers are few, the thicknesses are small, complicated intersystem interconnection is flexibly achieved, and the relevant circuit boards are easy to process and achieve and low in costs; and besides, the circuit boards can be designed into independent modules, specific compositions of the stacked circuit boards can be defined and detached respectively according to application requirements, and the flexibility is good.

The invention discloses a copper nanometer wire-based copper-copper bonding process. An adhesion layer and a seed layer are sequentially precipitated on the surface of a substrate; a layer of photoresist is prepared on the seed layer, and a round hole is formed in the photoresist; copper is electroplated in the round hole to obtain a copper convex point; a Cu(OH)2 nanometer wire is grown on the surface of the copper convex point by a hydrothermal method; the residual photoresist is removed; the Cu(OH)2 nanometer wire is subjected to thermal decomposition to obtain a CuO nanometer wire; the CuO nanometer wire is reduced to obtain a copper nanometer wire; the copper nanometer wire is prepared on two substrates respectively by the steps, and the copper nanometer wires on the two substrates are bonded in a hot pressing way. The copper nanometer wires are prepared by reduction and are directly applied to subsequent bonding, an additional oxide layer removing step is avoided, a compact bonding layer can be obtained at relatively low temperature and pressure, the preparation process is simple, complex equipment is not required, the cost is low, and the bonding process has very high application value.

The invention provides a packaging method of a fan-out type chip, and a packaging structure. The packaging structure comprises chips with projections, wherein a dielectric layer is formed on the surfaces of the chips, and the projections are exposed from the surfaces; a plastic packaging material filled among the chips with the projections, wherein the height of the plastic packaging material is not higher than that of each projection so as to enable the projections to be exposed from the surface of the plastic packaging material; a rewiring layer formed on the chips with the projections and realizing interconnection among the chips; and projection lower metal layers and dimpling points. According to the invention, the dielectric layer exposing the projections is formed on the surfaces of the chips with the projections, the projections are protected, the subsequent interconnection among the chips is realized, and damaged or broken conditions of the projections caused by thermal expansion in the subsequent processes for manufacturing the rewiring layer of solder dimpling points are avoided, so that the packaging performance is substantially improved, and the yield is simultaneously improved.

The invention provides a manufacturing method of a printed circuit board realizing any layer interconnection. According to the method, after a hole is drilled in an inner core board, electroplating filling is performed, blind holes are drilled after outer boards are pressed on the inner core board, and electroplating filling is performed on the blind holes. Interconnection of inner and outer boards is realized through electroplating filling of the blind holes. Compared with the prior art, the method realizes four-level HDI any layer interconnection and hole stacking of eight-layer printed circuit board and has the advantages that the processing technology is simple, the method is suitable for popularization and the like.

The invention discloses a method for a carbon nano tube to achieve vertical interconnection of upper and lower layers of a conductive material, and belongs to the interconnection technology in an integrated circuit. The method comprises the following steps: preparing a vertical structure comprising upper and lower horizontal planes on a substrate; depositing the conductive material on the vertical structure to form upper and lower conductive layers; preparing carbon nano tube solution, dripping the carbon nano tube solution onto the vertical structure, applying direct current or alternating current between the upper and lower conductive layers, and lapping two ends of the carbon nano tube to the two conductive material layers; and depositing an insulating medium material to form a carbon nano tube through hole structure so as to achieve the vertical interconnection of the upper and lower layers of the conductive material. The preparation and assembly processes of the carbon nano tube are carried out respectively, and the assembly process is carried out at room temperature; therefore, the interconnection technology can avoid polluting a circuit chip during the preparation of the carbon nano tube, and can be compatible with the prior CMOS technology.

The invention discloses a method for processing a through hole of a printed circuit board, a printed circuit board and communication equipment. The method comprises the following steps: a single layer of the printed circuit board confirmed to be drilled is singly processed so as to obtain a metallic outer-layer shielded through hole; a conductive body is arranged in an axial parallel direction in the obtained outer-layer shielded through hole, and an insulating medium is contained between the conductive body and the outer-layer shielded through hole; and the conductive body is connected with a confirmed cable. The printed circuit board comprises at least one single-layer board, wherein the single-layer board contains the metallic outer-layer shielded through hole; an axle centre in the outer-layer shielded through hole contains the conductive body, and the insulating medium is contained between the conductive body and the outer-layer shielded through hole; the conductive body is telecommunicated with the cable; and the position of the outer-layer shielded through hole wall, corresponding to the connecting part of the cable, contains a groove, and the insulating medium is filled in the groove. The technical scheme can lead signals at all layers in the printed circuit board to be connected with each other.

The invention provides an MEMS stereoscopic packaging-assembling oriented solder ball bump bonding method, belonging to the field of packaging interaction and assembly of MEMS devices and solving the problems that the existing MEMS device package bonding technology dose not realize standardization, and the existing MEMS device automatic bonding technology is only suitable for manufacture laser bumps of specific bonding pad surfaces, can not realize integration of bump manufacture and interaction, and is not suitable for MEMS device stereoscopic packaging. The method comprises the following steps: transporting a chip to be bound to the visual system work area of an image acquiring device, acquiring image information, calculating to obtain the positions of all the bonding pad centers to be bound of the chip to be bound, storing all position information, planning bumping bonding paths based on the position information, and bonding each bonding pad based on the bumping bonding paths, wherein the bonding step is composed of sucking micro solder balls by utilizing a suction nozzle, releasing the micro solder balls into the bonding center and finishing bonding. The invention is applicable to the stereoscopic packaging of the MEMS devices.

The invention provides a low-temperature electronic interconnection material, a preparation method thereof and a low-temperature electronic interconnection method. The low-temperature electronic interconnection material is a ternary-structure film layer material formed by combining a compact particle layer and a loosen particle layer. The invention also provides the preparation method of the low-temperature electronic interconnection material. The invention also provides the low-temperature electronic interconnection method. The low-temperature electronic interconnection method comprises the following steps of depositing and fabricating the low-temperature electronic interconnection material on a surface of a piece to be connected; and laminating a surface to be connected of the piece to be connected, employing an appropriate energy input means to make the low-temperature electronic interconnection material fully densified, and generating metallurgical bonding with the piece to be connected to achieve low-temperature electronic interconnection of the piece to be connected. The low-temperature electronic interconnection material has excellent low-temperature interconnection characteristic in practice.

The invention provides a networked comprehensive intelligent socket and an implementation method thereof based on alloy resistors and radio frequency identification (RFID). The socket comprises a RFID identifier. The circuit of the socket comprises alloy resistors and voltage measurement units which are in parallel connection with the alloy resistors. After the alloy resistors are connected in parallel with the voltage measurement units, the alloy resistors can be connected in series with a controllable switch and a large impedance device respectively to form series units, wherein one series unit, which is formed through the series connection of the alloy resistor and the controllable switch, is accessed to an electrical loop, and the large impedance device in other series unit which is formed through the series connection of the alloy resistor and the large impedance device is connected with a fire wire while the alloy resistor is connected with a zero wire; the controllable switch and a communication unit are connected with the output terminal of a microcontroller; the input terminal of the microcontroller is connected with the voltage measurement units and the RFID identifier respectively; the communication unit outputs information to a background system; and the microcontroller, the voltage measurement units and the communication unit are connected with the power supply unit respectively. According to the invention, electricity measurement of electrical appliances, automatic control, fault protection, data analysis, ID Identification and network communication are integrated in the socket, so that multifunctional, integrated and intelligent terminal equipment of intelligent power utilization network based on cloud computation is realized.

The invention discloses a method for realizing optical fibre interconnection based on an SAS / SATA interface, which comprises the following steps of: step A, performing negotiation to an out-of-band signal of the SAS interface by a sending terminal and a receiving terminal; and step B, directly transmitting a digital signal of the SAS interface to the receiving terminal through an optical fibre by the sending terminal after the negotiation of the out-of-band signal is completed. The invention also discloses an optical fibre interconnection system based on the SAS / SATA interface. The SAS interface negotiation is performed between the sending terminal and the receiving terminal through the optical fibre, and the digital signal of the SAS is transmitted directly through the optical fibre after the negotiation is completed, thus realizing the interconnection by using the optical fibre in the SAS interface, and breaking through the length limitation and EMC problem of SAS signals connected by cables. Therefore, a storage system framework has the advantages of being more flexible, more expansible and more reliable.