231results about How to "Interconnection" patented technology

The invention relates to the field of human health influence factor detection instruments, in particular to a wrist watch device with an intelligent health monitoring and alarming system and a method thereof. The wrist watch device comprises a wrist watch shell and a watch strap. A circuit of the intelligent health monitoring and alarming system is arranged in the cavity of the wrist watch shell, a display screen and an environment temperature infrared sensor are arranged on the face of the shell, an LED blood flow velocity acceleration sensor, an infrared body temperature sensor and a humidity sensor are equidistantly arranged in the middle of the bottom of the shell, and connection watch strap lugs are arranged on the left side and the right side of the shell. Wire connection terminals are arranged on the connection watch strap lugs. Ceramic pressure sensors are adopted as pulse sensors, installed at the contact portion of the bottom of the watch strap and the wrist of the human body and equidistantly arranged on the bottom of the watch strap in the vertical direction. Keys are arranged on the upper side of the shell. The wrist watch device with the intelligent health monitoring and alarming system and the method thereof have the advantages that the sensors and a single-chip microcomputer control the circuit to monitor various health indexes of users in real time, results are displayed through the display screen, and information is fed back to the users.

The present invention relates to an LCP substrate-based encapsulation shell and a preparation method. The encapsulation shell comprises a metal enclosure, a LCP substrate composite layer which is arranged below the metal enclosure, and a metal cover plate which covers the metal enclosure; a plurality of LCP substrates which are connected with one another and are laminated so as to form the LCP substrate composite layer; the metal enclosure is in airtight connection with the LCP substrate composite layer; the metal cover plate is in airtight connection with the metal enclosure; the LCP substrate composite layer includes a chip adhesive layer, a gold wire bonding layer, components and a metal enclosure welding layer which are connected with one another sequentially; through holes are formed in the metal enclosure welding layer, so that excellent grounding and space isolation are realized; and electroplated solid holes are formed in each layer of the LCP substrate composite layer, so that electrical connection between any layers can be realized. The shell of the invention has the advantages of high air tightness, small size and light weight, and can be applied to high-frequency integrated circuits such as microwave and millimeter wave integrated circuits.

The invention provides a tin-radical welding flux/copper particle composite welding flux capable of forming high-temperature welding spots rapidly at a low temperature. The tin-radical welding flux/copper-particle composite welding flux is composed of tin-radical welding flux powder, copper particle powder and welding paste, wherein the weight ratio of the tin-radical welding flux powder and the copper-particle powder lies between 5:2 and 2:3, the weight ratio of the remaining welding paste is 4%-20%, the particle size of the tin-radical welding flux powder is preferentially from 5 micrometers to 60 micrometers, and the particle size of the copper particle powder is from 0.1 micrometer to 10 micrometers. By means of the tin-radical welding flux/copper particle composite welding flux, the characteristics of a low melting point of the tin-radical welding flux and good wetting reaction of tin-copper are utilized, the high-melting intermetallic compound (IMC) interconnection welding spots can be formed within a short moment at the low temperature and without any pressure, and the tin-radical welding flux/copper particle composite welding flux is applicable to leading wire interconnection of electronic devices when a high temperature is caused during the service process or which performs the service at the high temperature. According to the tin-radical welding flux/copper particle composite welding flux capable of forming the high-temperature welding spots rapidly at the low temperature, the technology is simple, the cost is low, the practicability is great, and the problems of high cost, long welding time and high welding temperatures in existing chip packaging materials are solved.

The invention relates to a method for route transmission and address conversion of network message based on IPSec security association, which combines the address conversion of a network message, route transmission and IPSec processing together. The method is implemented by a gateway system that connects a local network and an external network and processes the network data stream that goes through the gateway system in one of three types of modes. In an IPSec route transmission mode, the gateway system determines destination (the local network) node and the route of the entry network message according to whether the network message is the IPSec message or the security association used by the IPSec message, and then the gateway system transmits the network message to the destination node; in an IPSec processing and route mode, the gateway system carries out IPSec processing to exit and entry messages as well as route transmission of the entry message based on the security association; and compared with the IPSec processing and route mode, in an IPSec route and address conversion mode, a step of network address conversion is added.

The invention discloses a method for interconnecting domains of a transparent interconnection over lots of links (TRILL) network. The method comprises the following steps that: the network is divided into different TRILL domains; a border Rbridge (BRB) in each TRILL domain informs an Rbridge of a local TRILL domain about the position information of a remote-end TRILL domain and the position information of a brother TRILL domain; when detecting that a destination media access control (MAC) address of a data frame is not in the local TRILL domain and the remote-end TRILL domain, the BRB packages the position information of the local TRILL domain into the data frame, and transmits the data frame to the remote-end TRILL domain; and when detecting that the destination MAC address of the data frame is in the local TRILL domain or the remote-end TRILL domain, the BRB transmits the data frame to an Rbridge corresponding to the destination MAC address. The invention also discloses a system for interconnecting the domains of the TRILL network. Due to the adoption of the scheme, the domain-based management of the TRILL network can be realized, and the problem of massive MAC information during the interconnection of a great number of TRILL domains is solved.

An embodiment of the invention relates to a data packet processing method and device. The method includes the steps: receiving a data packet forwarded by a source virtual switch and transmitted by a source virtual machine by a source controller; recognizing whether a TP (teleprocessing) address is stored in an address list or not by the source controller; determining that an objective virtual machine is not positioned in a source data center by the source controller if the TP address is not stored in the address list; determining first forwarding rules for forwarding the data packet to the objective virtual machine by the source controller; respectively transmitting the first forwarding rules to the source virtual switch and a source virtual proxy by the source controller, accordingly, forwarding the data packet to the source virtual proxy according to the first forwarding rules by the source virtual switch, and forwarding the data packet to an objective data center of the objective virtual machine according to the e first forwarding rules and a stored route forwarding table by the source virtual proxy. The source controller, the source virtual switch, the source virtual machine and the source virtual proxy are positioned at the source data center.

The invention discloses an electromobile power platform system with integrative control, which comprises a power battery pack, a battery guard plate, a motor controller and a motor, The motor is connected with the motor controller through a motor three-phase power line, a motor speed signal line and a motor control signal line; the motor controller is connected with a positive electrode and a negative electrode of the power battery pack; and the battery guard plate is connected with the motor controller through a low electric quantity alarming signal line, a low voltage protecting signal line and a high voltage protecting signal line for sending low electric quantity alarming signals, low voltage protecting signals and high voltage protecting switch signals to the motor controller. According to the electromobile, the motor controller provides charging protection and discharging protection for the power battery pack, so as to overcome the problem of damage on the battery guard plate and the motor controller by surge current formed due to the fact that the battery guard plate suddenly powers off to protect the power battery pack, the efficiency and the reliability of the system are improved and the cost is reduced.

The invention discloses a system for cross backup of telemetering and digital transmission data channels for aerospace applications. The system comprises an integrated electronic subsystem, a spaceborne measurement control transponder, a digital transmission subsystem and spaceborne data equipment which are locally arranged on a satellite platform, wherein data transmission channels exist between the spaceborne data equipment and the integrated electronic sub-system and the digital transmission subsystem, and a data transmission channel is established between the integrated electronic sub-system and the digital transmission subsystem through the spaceborne data equipment to achieve the interconnection and multiplexing between a telemetering data download channel and a digital transmission data download channel; the spaceborne data equipment achieves the exchange of the telemetering/remote control data through a measurement control channel and the integrated electronic subsystem, unidirectionally transmits the large-capacity test data to the digital transmission subsystem at high speed through an LVDS data interface, and also achieves a two-way data connection through an RS-422 data interface and the digital transmission subsystem. According to the system disclosed by the invention, the advantages of the telemetering channel and the digital transmission channel are fully combined, the advantage complementation and cross backup of the telemetering channel and the digital transmission channel can be achieved, and the real-time performance and security of the data can be increased.

The invention provides an energy management system for a ship. The energy management system for the ship mainly comprises a power supply and distribution management module, a load management module, a security management module, a system analysis module, an information network management module and the like. The energy management system can effectively and rapidly dispatch electric energy and reasonably distribute and use electric energy according to operating conditions of the ship, can effectively manage the electric energy and power utilization conditions of various loads of the whole ship, so shat short supply, surplus and delayed distribution of electric energy of a power supply system are avoided to the greatest extent; and simultaneously, interconnection and intercommunication of a control network and an information network of the ship can be conveniently achieved in a flattening ship control network form due to the usage of an industrial Ethernet, seamless combination of high-level business information with ship automation can be completed, so that a totally open ship network system structure is formed in a real sense.

The invention is applicable to the field of circuit board connection structures and discloses a circuit board connection structure which comprises a secondary board and at least two main boards arranged in a stacking mode. Electric connectors are fixedly arranged on the main boards, and the secondary board and the electric connectors on the at least two main boards are connected. According to the circuit board connection structure, a plurality of circuit boards are stacked on three-dimensional space, and the limit that the circuit boards are arranged on two-dimensional plane is broken through so that intersystem interconnection is achieved, and a large quantity of signals is communicated; the number of layers of printed circuit boards (PCBs) is small, the external sizes are reduced, the sizes of a single main board and a single secondary board are small, wiring layers are few, the thicknesses are small, complicated intersystem interconnection is flexibly achieved, and the relevant circuit boards are easy to process and achieve and low in costs; and besides, the circuit boards can be designed into independent modules, specific compositions of the stacked circuit boards can be defined and detached respectively according to application requirements, and the flexibility is good.

The invention discloses a copper nanometer wire-based copper-copper bonding process. An adhesion layer and a seed layer are sequentially precipitated on the surface of a substrate; a layer of photoresist is prepared on the seed layer, and a round hole is formed in the photoresist; copper is electroplated in the round hole to obtain a copper convex point; a Cu(OH)2 nanometer wire is grown on the surface of the copper convex point by a hydrothermal method; the residual photoresist is removed; the Cu(OH)2 nanometer wire is subjected to thermal decomposition to obtain a CuO nanometer wire; the CuO nanometer wire is reduced to obtain a copper nanometer wire; the copper nanometer wire is prepared on two substrates respectively by the steps, and the copper nanometer wires on the two substrates are bonded in a hot pressing way. The copper nanometer wires are prepared by reduction and are directly applied to subsequent bonding, an additional oxide layer removing step is avoided, a compact bonding layer can be obtained at relatively low temperature and pressure, the preparation process is simple, complex equipment is not required, the cost is low, and the bonding process has very high application value.

The invention provides a packaging method of a fan-out type chip, and a packaging structure. The packaging structure comprises chips with projections, wherein a dielectric layer is formed on the surfaces of the chips, and the projections are exposed from the surfaces; a plastic packaging material filled among the chips with the projections, wherein the height of the plastic packaging material is not higher than that of each projection so as to enable the projections to be exposed from the surface of the plastic packaging material; a rewiring layer formed on the chips with the projections and realizing interconnection among the chips; and projection lower metal layers and dimpling points. According to the invention, the dielectric layer exposing the projections is formed on the surfaces of the chips with the projections, the projections are protected, the subsequent interconnection among the chips is realized, and damaged or broken conditions of the projections caused by thermal expansion in the subsequent processes for manufacturing the rewiring layer of solder dimpling points are avoided, so that the packaging performance is substantially improved, and the yield is simultaneously improved.

The invention provides a manufacturing method of a printed circuit board realizing any layer interconnection. According to the method, after a hole is drilled in an inner core board, electroplating filling is performed, blind holes are drilled after outer boards are pressed on the inner core board, and electroplating filling is performed on the blind holes. Interconnection of inner and outer boards is realized through electroplating filling of the blind holes. Compared with the prior art, the method realizes four-level HDI any layer interconnection and hole stacking of eight-layer printed circuit board and has the advantages that the processing technology is simple, the method is suitable for popularization and the like.

The invention discloses a method for a carbon nano tube to achieve vertical interconnection of upper and lower layers of a conductive material, and belongs to the interconnection technology in an integrated circuit. The method comprises the following steps: preparing a vertical structure comprising upper and lower horizontal planes on a substrate; depositing the conductive material on the vertical structure to form upper and lower conductive layers; preparing carbon nano tube solution, dripping the carbon nano tube solution onto the vertical structure, applying direct current or alternating current between the upper and lower conductive layers, and lapping two ends of the carbon nano tube to the two conductive material layers; and depositing an insulating medium material to form a carbon nano tube through hole structure so as to achieve the vertical interconnection of the upper and lower layers of the conductive material. The preparation and assembly processes of the carbon nano tube are carried out respectively, and the assembly process is carried out at room temperature; therefore, the interconnection technology can avoid polluting a circuit chip during the preparation of the carbon nano tube, and can be compatible with the prior CMOS technology.

The invention provides a low-temperature electronic interconnection material, a preparation method thereof and a low-temperature electronic interconnection method. The low-temperature electronic interconnection material is a ternary-structure film layer material formed by combining a compact particle layer and a loosen particle layer. The invention also provides the preparation method of the low-temperature electronic interconnection material. The invention also provides the low-temperature electronic interconnection method. The low-temperature electronic interconnection method comprises the following steps of depositing and fabricating the low-temperature electronic interconnection material on a surface of a piece to be connected; and laminating a surface to be connected of the piece to be connected, employing an appropriate energy input means to make the low-temperature electronic interconnection material fully densified, and generating metallurgical bonding with the piece to be connected to achieve low-temperature electronic interconnection of the piece to be connected. The low-temperature electronic interconnection material has excellent low-temperature interconnection characteristic in practice.

The invention provides a networked comprehensive intelligent socket and an implementation method thereof based on alloy resistors and radio frequency identification (RFID). The socket comprises a RFID identifier. The circuit of the socket comprises alloy resistors and voltage measurement units which are in parallel connection with the alloy resistors. After the alloy resistors are connected in parallel with the voltage measurement units, the alloy resistors can be connected in series with a controllable switch and a large impedance device respectively to form series units, wherein one series unit, which is formed through the series connection of the alloy resistor and the controllable switch, is accessed to an electrical loop, and the large impedance device in other series unit which is formed through the series connection of the alloy resistor and the large impedance device is connected with a fire wire while the alloy resistor is connected with a zero wire; the controllable switch and a communication unit are connected with the output terminal of a microcontroller; the input terminal of the microcontroller is connected with the voltage measurement units and the RFID identifier respectively; the communication unit outputs information to a background system; and the microcontroller, the voltage measurement units and the communication unit are connected with the power supply unit respectively. According to the invention, electricity measurement of electrical appliances, automatic control, fault protection, data analysis, ID Identification and network communication are integrated in the socket, so that multifunctional, integrated and intelligent terminal equipment of intelligent power utilization network based on cloud computation is realized.

The invention discloses a method for realizing optical fibre interconnection based on an SAS/SATA interface, which comprises the following steps of: step A, performing negotiation to an out-of-band signal of the SAS interface by a sending terminal and a receiving terminal; and step B, directly transmitting a digital signal of the SAS interface to the receiving terminal through an optical fibre by the sending terminal after the negotiation of the out-of-band signal is completed. The invention also discloses an optical fibre interconnection system based on the SAS/SATA interface. The SAS interface negotiation is performed between the sending terminal and the receiving terminal through the optical fibre, and the digital signal of the SAS is transmitted directly through the optical fibre after the negotiation is completed, thus realizing the interconnection by using the optical fibre in the SAS interface, and breaking through the length limitation and EMC problem of SAS signals connected by cables. Therefore, a storage system framework has the advantages of being more flexible, more expansible and more reliable.