Semiconductor device, semiconductor chip, method for testing wiring between chips and method for switching wiring between chips
A semiconductor and chip-to-chip technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, and electric solid-state devices, and can solve problems such as practical limitations
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example 1
[0083] Next, the structure of the stacked semiconductor device of this working example will be described with reference to the drawings. FIG. 9 is a schematic view of a stacked semiconductor device of the present Working Example 1. FIG.
[0084] As shown in FIG. 9 , the stacked semiconductor device of this working example has a structure in which a chip A is stacked on a chip B. As shown in FIG. On chip A, a circuit 100A and a circuit 100A' are provided. On chip B, a circuit 100B and a circuit 100B' are provided. The connection between chips is realized through the regular inter-chip interconnect 111A, the regular inter-chip interconnect 111A′, and the spare inter-chip interconnect 121 .
[0085] In this working example, chip A and chip B are stacked, and in order to transfer signals from chip A to chip B, two regular interchip interconnects and one spare interchip interconnect are provided. When an electrical defect such as an open or short circuit occurs in any one of the...
example 2
[0106] The stacked semiconductor device of this working example is a device in which five chips are stacked.
[0107] FIG. 12A is a schematic view showing the structure of the stacked semiconductor device of this working example. FIG. 12B is a partially enlarged view of a redundancy switching portion shown by a dotted line in FIG. 12A.
[0108] As shown in FIG. 12A , the stacked semiconductor device has a structure in which a chip E, a chip D, a chip C, a chip B, and a chip A are sequentially stacked from the bottom. One spare interchip interconnect is provided for the four stock interchip interconnects between each chip. In FIG. 12A , the reference numerals of the regular interchip interconnect 112 and the preliminary interchip interconnect 122 are shown only for the interconnection between chip A and chip B. In FIG.
[0109] FIG. 12B shows the redundancy switching part of Chip C and Chip D. Here, to simplify the illustration, only one of the four stock interchip interconn...
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