Production process of FPC board

Abstract

The invention discloses a production process of an FPC board. The production process comprises the steps of selecting substrates, stacking 2-13 substrates for baking at 100-140 DEG C for 45-75min; drilling via holes and positioning holes in the substrates and coating the substrates with copper; humidifying and laminating the substrates and a film and then carrying out exposure, development and etching to obtain front and back circuits separately; and carrying out high-temperature lamination on at least two substrates to obtain a circuit board. The stacking density and the substrate baking temperature and time are comprehensively considered, so that the substrate baking quality and the substrate baking efficiency are ensured, and manpower and material resources are saved; the substrates andthe film are tightly fitted when laminated to remove gaps and bubbles, and the film does not locally tilt or deform, so that the exposure accuracy is good, the geometrical tolerance of the circuits in development and etching is minimum, and the circuits are clear and free of corner deficiency.

Description

technical field [0001] The invention relates to an FPC board, in particular to a manufacturing process of an FPC board. Background technique [0002] With the continuous development of the electronics industry, flexible PCB boards continue to expand. The circuit in the flexible PCB board is relatively small, and the copper thickness is also small, and its processing accuracy greatly affects the electrical characteristics of the circuit. [0003] In the prior art, the film and the copper layer are not tightly adhered, small air bubbles appear in the middle, or there is a protrusion in the middle of the film. As a result, the exposure margin on the copper layer is not clear and clear, and the margin is not neat. After etching and development, the corners of the circuit are incomplete, and the electrical characteristics of the circuit are poor. Contents of the invention [0004] For overcoming the deficiencies in the prior art, the object of the present invention is to prov...

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, the film and the copper layer are not tightly attached, small bubbles appear in the middle, or there is a bulge in the middle of the film

As a result, the exposed edges on the copper layer are not clear and clear, and the edges are not neat. After etching and developing, the corners of the lines are incomplete, and the electrical characteristics of the lines are poor.

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