Heat conduction structure
A technology of thermally conductive structure and thermally conductive silica gel sheet, which is applied in semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., and can solve problems such as affecting the life of the device.
Pending Publication Date: 2018-09-11
LAKESIDE PHOTOELECTRONICS TECH JIANGSU CO
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Problems solved by technology
[0002] Since all modules of the microdisplay are integrated on a silicon chip of about 1 inch, it is easy to generate heat in a short time when the display is turned on. If the heat cannot be well conducted and dissipated, it will affect the life of the device
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[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other.
[0014] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
[0015] Refer below figure 1 Some embodiments according to the invention are described.
[0016] Such as figure 1 As shown, the heat conduction structure according to an embodiment of the present invention is used for the heat conduction of the module, and the heat conduction structure includes in turn from the inside to the outside: a sil...
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The invention provides a heat conduction structure. The heat conduction structure is used for the heat conduction of a module. The heat conduction structure includes a silicon base, a heat conductionsilica gel sheet, an alumina ceramic sheet and an aluminum plate which are sequentially distributed from inside to outside; the silicon base has a first predetermined thickness; the heat conduction silica gel sheet is adhered to the silicon base; the heat conduction silica gel sheet has a second predetermined thickness; the alumina ceramic sheet is adhered to the heat conduction silica gel sheet;the alumina ceramic sheet has a third predetermined thickness; the aluminum plate is adhered to the alumina ceramic sheet; the aluminum plate has a fourth predetermined thickness; and the module is located in the silicon base. According to the heat conduction structure provided by the technical schemes of the present invention adopted, heat generated by the module is better led to the outside through a three-stage heat conduction structure, so that the heat dissipation of a micro display can be improved.
Description
technical field [0001] The present invention relates to the technical field of module packaging, in particular to a heat conduction structure. Background technique [0002] Since all modules of the microdisplay are integrated on a silicon chip of about 1 inch, it is easy to generate heat in a short time when the display is turned on. If the heat cannot be well conducted and dissipated, it will affect the life of the device . Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art. [0004] In view of this, the object of the present invention is to provide a heat conducting structure. [0005] In order to achieve the above object, the technical solution of the present invention provides a heat conduction structure for the heat conduction of the module, the heat conduction structure includes from the inside to the outside in turn: a silicon base, the silicon base has a first pres...
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Login to View More IPC IPC(8): H01L23/373
CPCH01L23/3735
Inventor 吴空物刘志文
Owner LAKESIDE PHOTOELECTRONICS TECH JIANGSU CO