Thermal conductive silica gel gasket

Abstract

The invention discloses a thermal conductive silica gel gasket, which includes a thermal conductive plate. A plurality of T-shaped grooves are arranged inside the thermal conductive plate. A reinforcing mechanism is arranged in each T-shaped groove. Two sides of the thermal conductive plate are fixedly connected with glass fiber layers. Two sides of each glass fiber layer are each provided with athermal conductive insulating rubber layer. Multiple clamp bars are fixedly connected with two facing sidewalls of the thermal conductive insulating rubber layers. One side of each glass fiber layer,close to the clamp bars, is provided with bar-shaped clamp grooves that correspond to the clamp bars in position. Multiple filling cavities are arranged inside each thermal conductive insulating rubber layer, and the filling cavities are filled with filling agents. One side of each thermal conductive insulating rubber layer, away from the glass fiber layers, is provided with a flexible thermal conductive pad. The thermal conductive silica gel gasket is simple in structure and reasonable in design. Through adoption of the multiple glass fiber layers and the thermal conductive insulating rubberlayers, the mechanical strength and the heat transfer effect of the thermal conductive silica gel gasket can be improved to a certain extent, and the gasket has good application effects.

Description

technical field [0001] The invention relates to the technical field of heat-conducting silica gel, in particular to a heat-conducting silica gel gasket. Background technique [0002] With the development of integration technology and the intensive assembly of microelectronics, the heat generated by electronic equipment accumulates and increases rapidly. As the temperature of electronic components increases, their performance and reliability will directly decrease. Therefore, whether they can dissipate heat in time becomes an important factor affecting their service life. In order to ensure that electronic components can still maintain normal working conditions under the ambient temperature of use, a layer of thermally conductive insulating film is usually placed on the heat exchange interface of related components as a thermally conductive interface material to quickly transfer the heat of the heating element to the cooling device. , to ensure the normal operation of electr...

AI Technical Summary

Problems solved by technology

However, the thermal insulation materials currently available on the market mainly use a single-layer silicone rubber thermal insulation gasket with a simple structure. Most of the silicone gaskets have relatively poor mechanical strength, and there are still deficiencies in impact resistance. At the same time, the heat transfer effect is not good. very good

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