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Disc loading substrate surface coating device

A technology of substrate surface and coating device, which is applied to the device for coating liquid on the surface, pretreatment surface, coating, etc., can solve the problems of damage to the surface sprayed with glue, difficult to adhere to, and difficult to collect.

Inactive Publication Date: 2018-09-28
MAANSHAN JULI SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One of the more important steps in the processing of multilayer boards is substrate glue coating, which is to coat a layer of insulating glue with uniform thickness on the surface of the raw material boards that make up the multilayer boards, so as to facilitate the bonding between the raw material boards. Using a glue gun to directly spray glue on the surface of the continuously conveyed substrate, it is difficult for the glue to adhere evenly on the surface of the substrate, and it is difficult to collect the substrate continuously conveyed through the conveyor belt after spraying glue, which will damage the surface sprayed with glue

Method used

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  • Disc loading substrate surface coating device
  • Disc loading substrate surface coating device
  • Disc loading substrate surface coating device

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Embodiment Construction

[0028] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11As shown, a disk-loading substrate surface coating device includes a frame 1, a pushing cylinder 2, a lower supporting plate 3, a pushing head 4, a bracket 5, a board box 6, a carrier strip 7, and a pre-pressing mechanism 8. Glue tank 9, peristaltic pump 10, coating mechanism 11, reclaiming mechanism 12, jacking cylinder 13, carrier mechanism 14, column 15, servo motor 16, gear 17, slewing bearing 18, disc 19, aggregate Mechanism 20, support 21, support rod 22, baffle plate 23, described pushing material cylinder 2 is positioned at the left lower end of frame 1, and described pushing material cylinder 2 is connected with frame 1 by bolt, and described lower supporting plate 3 is located at the lower end of the frame 1, the lower supporting plate 3 is connected with the frame 1 by bolts, the pushing head 4 is located at the up...

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Abstract

The invention discloses a disc loading substrate surface coating device. The disc loading substrate surface coating device comprises a frame, a pushing cylinder, a lower support plate, a push head, abracket, a plate box, a plate carrying bar, a prepressing mechanism, a glue box, a peristaltic pump, a coating mechanism, a taking mechanism, a jacking cylinder, a plate carrying mechanism, a stand column, a servo motor, a gear, a revolving support, a disc, a collecting mechanism, a bracket, a support rod and a baffle plate. The device is simple in structure, can coat the surfaces of substrates with glue, can continuously stack the substrates coated with the glue into the collecting mechanism to achieve subsequent multilayer pressing, meanwhile, is uniform in coating to prevent the condition of bad glue adhesion caused by secondary pollution, is precise in gluing area, and effectively prevents wastes of the glue as the glue can be recycled.

Description

technical field [0001] The invention relates to a mechanical device, in particular to a disk feeding type substrate surface coating device. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. They can be divided into single-layer boards and multi-layer boards according to the number of layers. Multi-layer boards are designed for printing due to their high integration and compact structure. The main development direction of the circuit board. A relatively important process in the processing of multilayer boards is substrate glue coating, which is to coat the surface of the raw material boards that make up the multilayer board with a layer of insulating glue with uniform thickness to facilitate the bonding between the raw material boards. Using a glue gun to directly spray glue on the surface of the substrate that is continuously conveyed, it is difficult for the glue to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C1/12B05C1/08B05C13/02B05C9/10B05C11/10B05D3/00
CPCB05C1/12B05C1/0813B05C1/0817B05C1/0821B05C1/0865B05C9/10B05C11/1039B05C13/02B05D3/002
Inventor 史治强
Owner MAANSHAN JULI SCI & TECH
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