Plasma etching machine for semiconductor production
A plasma and etching machine technology, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve the problems of poor shock absorption effect, inconvenient wheel fixing, etc., to ensure stability, quality assurance, and reduce the probability of damage Effect
Active Publication Date: 2019-11-05
JIANGSU XIYI HIGH NEW DISTRICT TECH DEV CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to provide a plasma etching machine for semiconductor production, to solve the problem that the existing plasma etching machine proposed by the above-mentioned background technology has poor shock absorption effect and is inconvenient to fix the runners
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0018] see Figure 1-4 , the present invention provides a technical solution: a plasma etching machine for semiconductor production, including a plasma etching machine body 1, a first fixed block 2, a first pin shaft 3, a first pulley 4, a first elastic element 5, The second fixed block 6, the second pin shaft 7, the second pulley 8, the baffle plate 9, the support rod 10, the third pin shaft 11, the second elastic element 12, the steel wire 13, the rotating s...
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The invention discloses a plasma etching machine for semiconductor production. The plasma etching machine comprises a plasma etching machine body, first elastic elements and second elastic elements. First fixed blocks are set at the bottom of the plasma etching machine body. First hinge pins are mounted in the first fixed blocks. One end of the first elastic elements is fixed on the bottom surfaceof the plasma etching machine body. The other end of the first elastic elements is connected with second fixed blocks. Second hinge pines are set in the second fixed blocks. Baffles are set at the sides of the second fixed blocks. One end of the second elastic elements is fixed at inner sides of support rods. Steel wires are connected with outer walls of the support rods. A third fixed block is set at the center of the bottom of the plasma etching machine body. The plasma etching machine for semiconductor production has a damping effect. The safety of equipment in the device is ensured in a transport process. A function of preventing relative movement of the device is achieved.
Description
technical field [0001] The invention relates to the technical field of plasma etching machines, in particular to a plasma etching machine for semiconductor production. Background technique [0002] Plasma etching machine, also known as plasma etching machine, plasma planar etching machine, plasma etching machine, plasma surface treatment instrument and plasma cleaning system, etc.; plasma etching is the most common form of dry etching, The principle is that the gas exposed to the electron area forms a plasma, and the resulting ionized gas and gas composed of released high-energy electrons form a plasma or ion. When the ionized gas atoms are accelerated by an electric field, they will release enough force to be driven away from the surface Forces to tightly bond materials or etched surfaces. [0003] However, the existing plasma etching machine has a poor shock absorption effect, which makes it inconvenient to transport and fix its wheels, which makes it inconvenient to use ...
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IPC IPC(8): H01J37/32
CPCH01J37/32807
Inventor 梁亚
Owner JIANGSU XIYI HIGH NEW DISTRICT TECH DEV CO LTD