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Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator

A piezoelectric vibrating element and a manufacturing method technology, which are applied in the directions of electrical components, printed circuit manufacturing, and electrical connection of printed components, etc., can solve the problems of complicated processing control, deterioration of electrode reliability, slow plating reaction speed, etc., and achieve reliable performance. Sex-enhancing effect

Active Publication Date: 2018-09-28
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the electroplating method, the electroless plating method has a slower plating reaction rate, so the processing time becomes longer and the processing control becomes complicated.
In addition, since the film thickness of the formed plating electrode layer is thinner than that of the electroplating method, the electrode of the base diffuses into the plating electrode layer, and the reliability of the conduction of the electrode deteriorates.

Method used

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  • Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator
  • Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator
  • Aggregate substrate for mounting piezoelectric vibration element thereon, manufacturing method therefor, and manufacturing method for piezoelectric vibrator

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Experimental program
Comparison scheme
Effect test

no. 1 approach ＝

[0029] ==First Embodiment==

[0030]

[0031] refer to Figure 1 ~ Figure 3 , the piezoelectric vibrator 1 according to this embodiment will be described. figure 1 It is an exploded perspective view of the piezoelectric vibrator according to the first embodiment of the present invention, figure 2 is a plan view of the first surface of the substrate according to the first embodiment of the present invention, image 3 It is a plan view of the second surface of the substrate according to the first embodiment of the present invention.

[0032] like figure 1 As shown, the piezoelectric vibrator 1 according to the present embodiment includes a piezoelectric resonator element (Piezoelectric Resonator) 100 , a cover member 200 , and a substrate 300 . The cover member 200 and the substrate 300 are part of the structure of a holder (case or package) for accommodating the piezoelectric vibrating element 100 .

[0033]The piezoelectric vibrating element 100 includes a piezoelectri...

no. 2 approach ＝

[0092] ==Second Embodiment==

[0093] Next, refer to Figure 11 as well as Figure 12 Next, the aggregate substrate (assemblage substrate 10B) according to the second embodiment of the present invention will be described.

[0094] Figure 11 is a plan view of the first surface 12B of the collective substrate 10B according to the second embodiment of the present invention, Figure 12 It is a plan view of the second surface 14B of the collective substrate 10B according to the second embodiment of the present invention. In this embodiment, if Figure 12 As shown, the aggregate substrate 10B differs from the aggregate substrate 10 in that a plurality of via-hole electrodes arranged along the Z′ axis are electrically connected on the second surface 14B (rear surface) of the aggregate substrate 10B.

[0095] like Figure 12 As shown, the collective substrate 10B includes an electrode layer 400B. In the electrode layer 400B, external electrodes 370 , 372 , 374 , and 376 , extr...

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PUM

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Abstract

The present invention comprises: preparing an aggregate substrate (10); and forming through-holes (20) and an electrode layer (400) in the aggregate substrate, wherein the electrode layer includes viaelectrodes respectively provided in the through-holes, back surface electrodes electrically connected to the via electrodes, a first wiring path and a second wiring path, the via electrodes have first and second via electrodes disposed in a first direction, the first wiring path includes a first extraction electrode provided in a first unit region and leading to a central part of a long side thattouches a second unit region, and a second extraction electrode provided in the second unit region and leading to a central part of a long side that touches the first unit region, the first and second via electrodes are electrically insulated from via electrodes disposed in a second direction in a substrate disposition region, and by connecting the first extraction electrode and the second extraction electrode to each other by the central parts of the long sides, the back surface electrode electrically connected to the first via electrode and the back surface electrode electrically connectedto the second via electrode are electrically connected to each other.

Description

technical field [0001] The present invention relates to a collective substrate for mounting a piezoelectric vibrating element, a method of manufacturing the same, and a method of manufacturing a piezoelectric vibrator. Background technique [0002] Piezoelectric vibrators used in oscillators, band-pass filters, and the like are known (see Patent Documents 1 and 2). For example, Patent Document 1 discloses, as a method of manufacturing a substrate for mounting a piezoelectric vibrating element in a piezoelectric vibrator, a multi-connected wiring substrate in which a plurality of rectangular-shaped individual substrates is formed, with A method in which the connection conductors connecting the electrodes on the long side and the short side of the wiring board and the ring-shaped common lead frame formed on the outer periphery of the mother board are subjected to a plating process on the wiring board. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2000-165004 [0...

Claims

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Application Information

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IPC IPC(8): H03H3/02H05K1/02H05K1/11H05K3/00H05K3/40
Inventor 新家博之串田道保
Owner MURATA MFG CO LTD