Injection mould as well as electronic equipment housing and processing method thereof

Abstract

The disclosure relates to an injection mould as well as an electronic equipment housing and a processing method thereof. The injection mould comprises a mold cavity and at least one material overflowwell, wherein the mold cavity is provided with a plurality of glue inlets and at least one overflow groove; the material overflow wells are communicated with the mold cavity by means of the overflow grooves; each material overflow groove is formed between formed between the two corresponding adjacent glue inlets. The processing method provided by the invention is characterized in that a cold material at the front end of an injection molding material can be enabled to flow into the material overflow wells through the overflow grooves before two strands of the injection molding material, injected into the adjacent glue inlets separately, are in contact with each other, so that the problem that the cold material causes pores, sand holes, joint lines or the like at the joint of the two strandsof the injection molding material can be avoided.

Description

technical field [0001] The present disclosure relates to the field of electronic technology, in particular to an injection mold, an electronic device housing and a processing method thereof. Background technique [0002] In the related art, by applying the injection molding process to the manufacturing process of the housing of the electronic equipment, the manufacturing efficiency and processing accuracy of the housing of the electronic equipment can be improved. During the injection molding process, the injection molding material is injected into the plastic inlet on the injection mold, so that the injection molding material fills the cavity in the injection mold, and then cools and solidifies to obtain the corresponding electronic device housing. [0003] However, when injecting injection molding material into each injection port, there are often some cold materials at the front of the injection molding material. When the materials are in contact with each other, the col...

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Problems solved by technology

[0003] However, when injecting injection molding material into each injection port, there are often some cold materials at the front of the injection molding material. When the materials are in contact with each other, the cold material will be concentrated at the joint position of the two injection molding materials, resulting in poor joint force of the molded electronic device housing structure at the corresponding position, and easy formation of joint lines, pores or sand holes, etc., not only The structural strength of the electronic equipment casing is reduced, easy to crack, and it will also affect its appearance

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