Method for manufacturing sensing device and sensing device
A manufacturing method and chip technology, applied in the field of sensors, can solve the problems of warping of flexible chips, affecting mounting quality, affecting the working accuracy of flexible chips, etc., to achieve the effect of improving warping, improving mounting quality, and ensuring working accuracy
Inactive Publication Date: 2018-10-09
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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Problems solved by technology
[0002] When some flexible chips are mounted on the flexible circuit board through the anisotropic conductive adhesive film in a high temperature environment, the flexible chip may warp due to the thermal expansion difference between the flexible chip and the flexible circuit board, which will affect the mounting quality , which ultimately affects the working accuracy of the flexible chip
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[0042] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0043] In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating ...
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The invention discloses a method for manufacturing a sensing device and the sensing device. The method comprises a step of pressing a flexible chip onto a flexible circuit board by an anisotropic conductive film, and a step of allowing ultraviolet rays to pass the flexible circuit board to irradiate the anisotropic conductive film for a first predetermined time to cure the anisotropic conductive film, wherein the curing temperature of the anisotropic conductive film is smaller than the deformation temperature of the flexible chip. According to the manufacturing method of the embodiment of thepresent invention, the anisotropic conductive film whose curing temperature is smaller than the deformation temperature of the flexible chip is used, the ultraviolet rays are used to irradiate the anisotropic conductive film from one side of the flexible circuit board to reach the curing temperature, the placement of the flexible chip, the anisotropic conductive film and the flexible circuit boardin a high-temperature environment is avoided, thus the warpage of the flexible chip is effectively avoided or at least improved, and the quality of the mounting is improved.
Description
technical field [0001] The invention relates to the field of sensors, in particular to a manufacturing method of a sensing device and the sensing device. Background technique [0002] When some flexible chips are mounted on the flexible circuit board through the anisotropic conductive adhesive film in a high temperature environment, the flexible chip may warp due to the thermal expansion difference between the flexible chip and the flexible circuit board, which will affect the mounting quality , which ultimately affects the working accuracy of the flexible chip. Contents of the invention [0003] Embodiments of the present invention provide a method for manufacturing a sensing device and the sensing device. [0004] The manufacturing method provided in the embodiment of the present invention is used to attach a flexible chip to a flexible circuit board, and the manufacturing method includes the following steps: [0005] Pressing the flexible chip onto the flexible circui...
Claims
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IPC IPC(8): H01L21/60H01L21/603H01L23/488H05K3/30
CPCH01L24/32H01L24/83H01L2224/83874H05K3/305
Inventor 侯美珍吴伟
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH