Method for processing square groove or special-shaped groove in printed circuit board with corner radius being less than 0.30 mm

Abstract

The invention discloses a method for processing a square groove or special-shaped groove in a printed circuit board with the corner radius being less than 0.30 mm. The method comprises the following steps: firstly drilling a first pre-drilled hole with a drill bit in a corner, wherein the first pre-drilled hole is tangent on the both sides of the corner; then drilling one or a plurality of secondpre-drilled holes in the both sides of the first pre-drilled hole, the first pre-drilled hole is tangent to the second pre-drilled holes, and the second pre-drilled holes is tangent to the edge of thecorner; secondly, drilling a plurality of pre-drilled holes between the first pre-drilled hole and the second pre-drilled holes to form a pre-drilled groove, and finally, changing to a milling method, and milling the contour of the square groove or special-shaped groove and other areas in the contour by a milling cutter. The method not only does not need to increase a punching process, reduces the production cost, and can avoid the occurrence of defects such as non-straight edge, layering, ink falling off, cracks and the like, and the quality of the printed circuit board is ensured.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, relates to a method for processing a square groove or a special-shaped groove in a printed circuit board with a corner radius less than 0.30 mm. Background technique [0002] With the rapid development of science and technology and the improvement of people's material living standards, the manufacturing technology of circuit boards is required to keep pace with the times, especially with market competition, people are looking for faster, better and more advanced technology , so that the level of productivity is continuously improved, the processing efficiency is maximized, and the manufacturing cost is minimized, so as to meet the needs of the rapid development of science and technology. [0003] The present invention is mainly aimed at circuit boards containing square grooves and special-shaped grooves in the board, and the corner radius is less than 0.30...

AI Technical Summary

Problems solved by technology

[0005] The disadvantages of the above method are: 1. There are a large number of fragmented punching shavings at the edge of the punching groove, which are not easy to remove, and the appearance of the product is poor. In addition, the edge burrs need to be removed before shipment, and secondary grinding is required. The production cycle is long. It consumes a lot of labor and the production cost is high; 2. When punching and cutting finished products, only one circuit board can be punched at a time, and the processing efficiency is low; 3. Due to the limitation of the service life of the die, as the number of times of use of the die increases, the die Gradually wear and tear, resulting in poor punching size, which cannot meet the customer's quality requirements for high-precision groove size circuit boards; 4. Since this processing method is processed by mechanical stamping, it is limited by the thickness of the circuit board. When it is large, it cannot be processed, and it cannot cover a wide range of circuit board sizes, and the use range is relatively large; 5. It is necessary to make a punching die separately, and the punching die can only punch one or two corresponding circuit boards, which covers a small range and has poor punching flexibility. high cost

[0006] To sum up, the use of die-cutting technology needs to increase the corresponding process, labor, materials and maintenance costs, which not only increases the manufacturing cost of the product, but also the quality is not easy to guarantee, and it is easy to have uneven edges, layering, ink Defects such as shedding and cracks, these problems restrict the development of enterprises to a certain extent

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