Preparation method of TFT substrate, TFT substrate and display device
A substrate and substrate technology, which is applied in the photoengraving process of the pattern surface, opto-mechanical equipment, original parts for opto-mechanical treatment, etc. Avoid shedding effects
Active Publication Date: 2018-10-16
BOE TECH GRP CO LTD +1
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Problems solved by technology
However, in practical applications, the effect of surface treatment technology is not very significant, and the phenomenon of open metal electrode patterns still occurs from time to time
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[0049]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0050] Please refer to figure 1 , a method for preparing a TFT substrate provided in an embodiment of the present invention, comprising:
[0051] Step S101, forming a metal conductive film layer on the substrate 1;
[0052] Step S102, forming a hydrophobic insulating film layer 3 on the metal conductive film layer;
[0053] Step S103, coating a photoresist coating on the hydrophobic insulating film layer 3, and patterning the photoresist coating by using an e...
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The invention relates to the technical field of display, and discloses a preparation method of a TFT substrate, the TFT substrate and a display device. The preparation method comprises the steps thata metal conducting film layer is formed on a base; a lyophobic insulating film layer is formed on the metal conducting film layer; an optical resist coating is applied on the lyophobic insulating filmlayer, and patterning processing is carried out on the optical resist coating by adopting an exposure technology to form a patterned optical resist layer; etching is carried out on the lyophobic insulating film layer to form a patterned lyophobic insulating layer; and etching is carried out on the metal conducting film layer to form a patterned metal electrode layer by adopting a copper etching liquid. According to the above preparation method, the lyophobic insulating film layer is formed on the metal conducting film layer, the adhesiveness between the optical resist coating and the lyophobic insulating film layer is better, and it is avoided that the optical resist layer falls due to the fact that an etching liquid transversely etches during subsequent metal conducting film layer etching, thereby being conductive to improving the preparation yield of the TFT substrate.
Description
technical field [0001] The invention relates to the field of display technology, in particular to a preparation method of a TFT substrate, a TFT substrate and a display device. Background technique [0002] In the existing production technology of flat panel displays, TFTs that have been industrialized mainly include amorphous silicon TFTs, polysilicon TFTs, and single crystal silicon TFTs. Generally, amorphous silicon TFTs are the most used array substrates for preparing flat panel displays. However, with the development of technology, metal oxide TFTs have appeared now. Metal oxide TFTs have the advantage of high carrier mobility, which can make TFTs smaller, improve the resolution of flat panel displays, and display better. At the same time, the use of metal oxide TFTs can also reduce characteristic unevenness, save materials and process costs, low process temperature, and high transparency. Therefore, the use of oxide TFTs has attracted much attention in the industry. ...
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IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1244H01L27/1248H01L27/1288H01L29/66969H01L29/7869G03F1/32G03F7/201G03F7/32H01L27/1225H01L27/1237H01L29/45
Inventor 宫奎徐德智田维古宏刚张玉虎
Owner BOE TECH GRP CO LTD