Method for regenerating TiN process Ti material part of film fabrication of semiconductor 8-inch wafer manufacturing
A technology for semiconductors and parts, applied in the field of Ti material parts regeneration by TiN process, it can solve the problems of damage to the surface coating of parts, environmental pollution, etc. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0024] The method for regenerating Ti material components of the TiN process in the thin film manufacturing process of semiconductor 8-inch wafers comprises the following steps:
[0025] (1) Under normal pressure, heat pure water or ultrapure water to 75~95°C, pass hot water into the high-pressure water pump, connect the high-pressure water pump to the nozzle, and spray the hot water through the nozzle to the surface of the Ti material parts. Not less than 85 bar, treatment for 22 minutes; when hot water is sprayed on the surface of Ti material parts, the jet direction of hot water at the outlet of the nozzle is oblique to the surface of Ti material parts, and the angle formed between the jet direction of hot water at the nozzle outlet and the surface of Ti material parts The range is arctan0.035;
[0026] (2) Use hot air to dry Ti parts, and the temperature of the hot air should not be higher than 100°C;
[0027] (3) Under normal pressure, when the Ti material parts are natu...
Embodiment 2
[0030] The method for regenerating Ti material components of the TiN process in the thin film manufacturing process of semiconductor 8-inch wafers comprises the following steps:
[0031] (1) Under normal pressure, heat pure water or ultrapure water to 75~95°C, pass hot water into the high-pressure water pump, connect the high-pressure water pump to the nozzle, and spray the hot water through the nozzle to the surface of the Ti material parts. Not less than 165bar, treatment for 35 minutes; when hot water is sprayed on the surface of Ti material parts, the hot water injection direction at the nozzle outlet is at an oblique angle to the surface of Ti material parts, and the angle formed between the hot water injection direction at the nozzle outlet and the surface of Ti material parts The range is arctan0.1763;
[0032] (2) Use hot air to dry Ti parts, and the temperature of the hot air should not be higher than 100°C;
[0033] (3) Under normal pressure, when the Ti material pa...
Embodiment 3
[0036] The method for regenerating Ti material components of the TiN process in the thin film manufacturing process of semiconductor 8-inch wafers comprises the following steps:
[0037] (1) Under normal pressure, heat pure water or ultrapure water to 75~95°C, pass hot water into the high-pressure water pump, connect the high-pressure water pump to the nozzle, and spray the hot water through the nozzle to the surface of the Ti material parts. Not less than 110bar, treatment for 25min; when hot water is sprayed on the surface of Ti material parts, the hot water injection direction at the nozzle outlet is at an oblique angle to the surface of Ti material parts, and the angle formed between the hot water injection direction at the nozzle outlet and the surface of Ti material parts The range is arctan0.08;
[0038] (2) Use hot air to dry Ti parts, and the temperature of the hot air should not be higher than 100°C;
[0039] (3) Under normal pressure, when the Ti material parts are...
PUM
Property | Measurement | Unit |
---|---|---|
Granularity | aaaaa | aaaaa |
Granularity | aaaaa | aaaaa |
Granularity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com