Solder paste coating device for LED lamp processing
A coating device, LED lamp technology, applied to the surface coating liquid device, mixer with rotating stirring device, coating, etc., can solve the problems of low work efficiency, low work efficiency, easy hardening, etc., to achieve High work efficiency, improved connection firmness, and improved pass rate
Active Publication Date: 2021-07-13
王照云
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Problems solved by technology
However, since the push arm can only push the material to one side, the material will accumulate on one side. After a period of time, the solder paste needs to be manually shoveled to the other side, and the work efficiency is low.
And in this way, there is usually a layer of solder paste remaining on the leaking material board, and this layer of solder paste is easy to harden, and then when the next coating is applied, there is likely to be hardened solder paste in the solder paste leaked to the circuit board, and then Affect the adhesion effect of the lamp beads in the later stage, the connection between the lamp beads and the circuit board is low, and the lamp beads are easy to fall off; but if it is manually scraped off every time, the work efficiency will be low and the workload of the workers will be huge
Method used
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[0035]In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.
[0036] Such as Figure 1-11 As shown, a solder paste coating device for LED lamp processing includes a frame 1, a coating table 2, a leaking plate 3, a moving frame 4, a discharge part 5, a storage box 6, a scraping device and Residual material recovery device; the coating platform 2 is arranged on the frame 1, and the coating platform 2 is provided with a plurality of threaded holes and two strip plates made of metal, and the strip plates are connected with the threaded holes by screws. The position of the strip plate can be adjusted by connecting the adjusting screw with the threaded holes at different positions. The material to be coated, such as a circuit board, can be pla...
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The invention discloses a solder paste coating device for processing LED lamps, which includes a frame; a coating table, which is arranged on the frame, and is used for positioning the material to be coated; a leaking plate, which can move up and down It is arranged above the coating table, on which there is a leaking hole for the solder paste to pass through; a movable frame on the frame that can move left and right; a discharge piece that can move up and down on the movable frame. During the left and right movement of the moving frame, the solder paste is applied to the leaking plate; the storage box is used to store the solder paste, and is connected with the discharge part through the feeding channel; the scraping device is located on the On the mobile frame mentioned above, it is used to scrape off the excess solder paste on the leakage plate when the mobile frame moves left and right. The present invention can directly scrape excess solder paste off the leaking plate through the scraping device, thereby avoiding a thin layer of solder paste remaining on the leaking plate, which will not affect the next coating of solder paste, and does not require Manual scraping, high work efficiency.
Description
technical field [0001] The invention belongs to the technical field of energy-saving lighting, and in particular relates to a solder paste coating device for LED lamp processing. Background technique [0002] LED light is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. LED is usually composed of a circuit board and lamp beads welded on the circuit board. In its production process, the solder paste is usually first applied to the circuit board through a leaky board with holes, and then the lamp beads are installed until the finished coating is completed. At the position of the solder paste, the circuit board is heated to harden the solder paste to realize the welding of the lamp beads. [0003] However, in the traditional solder paste coating device, the solder paste accumulated on the bleeder is usually pushed from one side to the other side by the push arm moving left and right, s...
Claims
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IPC IPC(8): B05C11/10B01F7/04
CPCB05C11/1036B01F27/70
Inventor 潘明安
Owner 王照云