High heat dissipation silicon/glass composite interposer and manufacturing method thereof
A technology with high heat dissipation and adapter board, which is applied in the manufacture of semiconductor/solid state devices, semiconductor/solid state device components, semiconductor devices, etc., to achieve the effect of low pressure drop and strong heat dissipation capability
Active Publication Date: 2020-05-22
PEKING UNIV
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[0014] Third: At present, the microfluidic system cooling technology is mostly used in the field of digital chips, and there is little research on its application in the field of radio frequency. For the field of high-power radio frequency, substrates with strong heat dissipation capabilities are especially important
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[0038] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described below through specific embodiments and accompanying drawings.
[0039] The core idea of the present invention is to embed microchannels in the adapter plate, and form a silicon / glass adapter plate with high heat dissipation performance through high-temperature glass reflow technology. Glass has the advantage of low-loss transmission due to its small loss tangent and electrical insulation. Especially in the radio frequency network, the radio frequency matching network can be made on the glass, and the layout and wiring can be carried out on the glass surface. Therefore, the strong heat dissipation capability of the silicon microchannel and the high dielectric properties of the glass can be combined, so that the silicon / glass transition plate has a strong heat dissipation capability and excellent electrical...
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The invention provides a high-heat dissipation silicon-glass composite adapter plate. The composite adapter plate comprises a lower silicon wafer, an upper silicon wafer and a glass sheet which are stacked sequentially; interdigital cooling liquid inlet and outlet channels are formed in the back face of the lower silicon wafer, a cooling liquid inlet and a cooling liquid outlet communicated with the two ends of the cooling liquid inlet and outlet channels are formed in the front face of the lower silicon wafer; capillary micro-channels communicated with the cooling liquid inlet and outlet channels are formed in the back face of the upper silicon wafer, and at least one bonding protrusion portions is formed in the front face of the upper silicon wafer; and the glass sheet is bonded with anupper glass sheet through the bonding protrusion portions. The composite adapter plate has the advantages of being high in heat dissipation performance and low in flow resistance, a good dielectric environment is provided, and a mature and feasible solution is provided for achieving the adaptor plate with high heat dissipation and good electric insulation in the radio frequency field. The invention further provides a manufacturing method of the adapter plate.
Description
technical field [0001] The invention relates to the field of microelectronic thermal management and advanced packaging, in particular to a composite adapter plate with high heat dissipation and a manufacturing method based on a micro-electromechanical system technology (MEMS technology) and a silicon chip with a micro-flow channel bonded to glass to form a composite adapter plate. Background technique [0002] With the maturity and wide application of multi-chipset interposer board packaging technology, the number of integrated chips on the interposer board continues to increase, resulting in a continuous increase in unit heat density on the substrate; The distribution is uneven, which creates localized hot spots. If the local hot spot heat cannot be dissipated in a timely manner, it is likely to reduce the performance of the entire system, or even cause the entire system to fail. Therefore, in order to solve this problem, it is necessary to develop a substrate with a stron...
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IPC IPC(8): H01L23/473H01L21/48
CPCH01L21/4882H01L23/473
Inventor 王玮朱龙光皮宇丹金玉丰
Owner PEKING UNIV