Structure for preventing bonding pad of flexible circuit board from falling off

Abstract

The invention belongs to the field of circuit boards and discloses a structure for preventing a bonding pad of a flexible circuit board from falling off. The structure comprises a circuit board substrate and the bonding pad, wherein a groove is arranged in the circuit board substrate; the bonding pad is placed into the groove of the circuit board substrate; the bonding pad comprises a first metalfoil and two second metal foils; the two second metal foils are fixedly connected to the left side and the right side of the bonding pad separately; central solder mask layers are arranged at the central positions of the first metal foil and the second metal foils and are insulators; a through hole is formed in the middle of each central solder mask layer; columnar bodies are correspondingly arranged in the groove of the circuit board substrate; each through hole sleeves the corresponding columnar body; the columnar bodies are also the insulators; an oil coating layer is arranged on the surfaces of the first metal foil and the second metal foils; and a green oil layer coats the upper surface of the oil coating layer. According to the structure, the contact area of the bonding pad and the substrate is not increased, and the structure is suitable for the development direction that the volume of an electronic product becomes smaller and smaller and wire arrangement is also more dense.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a structure for preventing pads of flexible circuit boards from falling off. Background technique [0002] At present, consumer electronic products are developing in the direction of small size and powerful functions. Electronic products are getting smaller and smaller, but with more and more integrated functions and various shapes. Flexible circuit boards are flexible and thin because of their characteristics. It can well meet the needs of the development of electronic products and is a popular direction for the development of existing circuit boards. Because the volume of its products is getting smaller and smaller, and the functions are more and more, the required line pads are getting smaller and smaller, and the wiring is more dense; in the prior art, the pads are usually enlarged to prevent the pads from falling off. Increase the contact surface between the pad and ...

AI Technical Summary

Problems solved by technology

Because the volume of its products is getting smaller and smaller, and the functions are more and more, the required line pads are getting smaller and smaller, and the wiring is more dense; in the prior art, the pads are usually enlarged to prevent the pads from falling off. Increase the contact surface between the pad and the base material, and then use the design method of covering and laminating the pad, but in the actual production process, the pad has fallen off before the covering layer process is reached, and as the product volume increases Smaller and denser wiring, so there is no extra space to increase the pad; in view of this, how to provide a structure to prevent the pads of the flexible circuit board from falling off in the existing technology and size is a technology that those skilled in the art need to solve question

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