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Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations

A technology of preparation and nickel alloy, which is applied in the field of die bonding paste and its preparation, conductive ink and its preparation, die bonding film and its preparation, and can solve the problems of easy corrosion, expensive silver and copper, etc.

Inactive Publication Date: 2018-11-09
HENKEL IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, although silver is a good conductor, it is expensive
Similarly, although copper is also a good conductor, it corrodes easily
Also, both silver and copper are expensive

Method used

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  • Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations
  • Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations
  • Use of nickel and nickel-containing alloys as conductive fillers in adhesive formulations

Examples

Experimental program
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preparation example Construction

[0177] According to another embodiment of the present invention, a method for preparing a conductive network is provided, the method comprising:

[0178] applying a composition for a film as described herein to a wafer;

[0179] laminating the composition onto a wafer at a temperature of 100° C. or less and a pressure of 40 psi or less to obtain a film attached to the wafer;

[0180] dicing the film attached to the wafer to obtain die and film; and

[0181] at 0.2kg / mm 2 up to 1kg / mm 2 The die and film are bonded to the substrate under pressure.

[0182] According to another embodiment of the present invention, a method for preparing a conductive network is provided, the method comprising:

[0183] applying a composition for paste as described herein to a substrate (eg, lead frame) in a predetermined pattern;

[0184] die attaching the composition to a die and a substrate; and

[0185] The composition is cured.

[0186] Optionally, the composition can be applied such th...

Embodiment 1

[0191] adhesive film

[0192] Formulations according to the invention were prepared by combining the components shown in Table 1 below.

[0193] Table 1

[0194]

[0195] As shown in Table 1, the resulting formulations were evaluated for volume resistivity (VR), showing that an exemplary formulation according to the invention (wherein 75% of the particulate conductive filler is nickel or nickel alloy and only 25% The granular conductive filler is silver) provided with 1×10 -2 Adhesive film of desired VR in Ohm cm.

Embodiment 2

[0197] adhesive film

[0198] Other formulations according to the invention were prepared by combining the components shown in Table 2 below.

[0199] Table 2

[0200]

[0201]

[0202] As shown in Table 2, the volume resistivity (VR) of the resulting formulations was evaluated, showing that an exemplary formulation according to the invention (in which about 69% of the particulate conductive filler is nickel or nickel alloy, and only 31% % of the granular conductive filler is silver) providing a 2×10 -3 Adhesive film of desired VR in Ohm cm.

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Abstract

In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inksand methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect the present invention provides novel die attach pastes and methods for the preparation thereof.

Description

technical field [0001] The present invention relates to a conductive adhesive and a preparation method thereof. In another aspect, the invention relates to conductive inks and methods of making them. In yet another aspect, the present invention relates to die attach films and methods of making the same. In yet another aspect, the invention relates to a die attach paste and a method of making the same. In yet another aspect, the invention relates to an assembly comprising a first article and a second article adhered to each other using a conductive adhesive according to the invention and a method of making the same. Background technique [0002] While silver and copper are widely used in conductive adhesives, there are potential problems with their use. For example, while silver is a good conductor, it is expensive. Similarly, although copper is also a good conductor, it corrodes easily. Also, both silver and copper are expensive. [0003] Therefore, there is a need in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J7/20C09J9/02C08K3/08C08K5/00H01B1/22
CPCH01B1/22C09J4/00C09J11/04C09J133/04C09J179/085C08K2003/0862C08K3/11C08L33/04C08L63/00H01L2224/29C08K2003/0856C09J9/02H01L24/29H01L2224/29298H01L2224/2929H01L2224/29339H01L2224/29355H01L2224/29357H01L2224/2936H01L2224/29439H01L2224/29347H01L2224/29388H01L2224/29393H01L2224/29386H01L2224/8385H01L2224/83101H01L24/83H01L2224/29499H01L2924/01026H01L2924/0781H01L2924/00014C08F222/102C08K3/08C09D11/03C09D11/10C09D11/52C09J163/00C09J2301/312H01L24/00C08K9/04C08K2003/0806C08K2003/0843C08K2003/085C08K2201/001C08K2201/005C08K2201/006C09J133/10C09J163/04C09J179/04
Inventor S·A·鲁阿塔G·卡森姚莉
Owner HENKEL IP