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A stacked package structure and terminal

A technology of packaging structure and packaging layer, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., and can solve problems such as easy partial filling

Active Publication Date: 2020-10-27
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present application provides a stacked packaging structure and a terminal, which are used to solve the problem of difficult or easy partial filling between two adjacent packaging layers in the prior art, and improve the reliability of the stacked packaging structure

Method used

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  • A stacked package structure and terminal
  • A stacked package structure and terminal
  • A stacked package structure and terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] The lower encapsulation layer 20 has a polygonal shape, and only one side of the lower encapsulation layer 20 is provided with a first potting area. In a specific embodiment, such as Figure 2a~Figure 2c Shown, where, Figure 2a It is a top view when the upper encapsulation layer 30 and the lower encapsulation layer 20 are stacked and arranged, Figure 2b For its front view, Figure 2c In its left view, in the stacked package structure, both the upper package layer 30 and the lower package layer 20 are rectangular, one side of the upper package layer 30 and one side of the lower package layer 20 have the same length, and the length of the upper package layer 30 The area is smaller than the area of ​​the lower encapsulation layer 20. When stacking and packaging, keep the sides of the upper packaging layer 30 and the lower packaging layer 20 of equal length aligned, so that one side of the lower packaging layer 20 will extend to the outside of the upper packaging layer 30, ...

Embodiment 2

[0079] The lower encapsulation layer 20 has a polygonal shape. At least two sides of the lower encapsulation layer 20 are provided with first potting areas, and at least two first potting areas are not connected to each other. In a specific embodiment, such as Figure 4a~Figure 4c Shown, where, Figure 4a It is a plan view when the upper encapsulation layer 30 and the lower encapsulation layer 20 are stacked and arranged, Figure 4b For its front view, Figure 4c In its left view, in the stacked package structure, the upper package layer 30 and the lower package layer 20 are both rectangular, one side of the upper package layer 30 and one side of the lower package layer 20 have the same length, and the length of the upper package layer 30 The area is smaller than the area of ​​the lower encapsulation layer 20. When stacking and packaging, the upper encapsulation layer 30 and the center of the lower encapsulation layer 20 are aligned up and down, and at the same time, the sides of...

Embodiment 3

[0082] The lower encapsulation layer 20 has a polygonal shape. When each side of the lower encapsulation layer 20 is provided with a first potting area, the first potting areas provided on each side communicate with each other to form a frame shape. In a specific embodiment, such as Figure 6a~Figure 6c As shown, where Figure 6a It is a top view when the upper encapsulation layer 30 and the lower encapsulation layer 20 are stacked and arranged, Figure 6b For its front view, Figure 6c In its left view, in the stacked package structure, both the upper package layer 30 and the lower package layer 20 are rectangular, and the length and width dimensions of the upper package layer 30 are smaller than the length and width dimensions of the lower package layer 20. The encapsulation layer 30 is aligned up and down with the center of the lower encapsulation layer 20, and at the same time, the sides of the upper encapsulation layer 30 and the sides of the lower encapsulation layer 20 are...

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Abstract

A stacked packaging structure and terminal, the stacked packaging structure comprising: a main board (10) and at least two packaging layers stacked along a direction away from the main board, wherein the packaging layer closest to the main board side among the at least two packaging layers and The main board is welded and connected; the packaging layer close to the main board side in any two adjacent packaging layers is the lower packaging layer (20), the packaging layer away from the main board side is the upper packaging layer (30), the lower packaging layer and the upper packaging layer welding connection; a first glue filling layer (40) is also provided between the lower packaging layer and the upper packaging layer, and a first glue filling area (21) corresponding to the first glue filling layer is provided in the lower packaging layer, and the second A glue filling area does not overlap with the upper encapsulation layer. When dispensing, drop the dispensing material on the first glue filling area of ​​the lower packaging layer, stop dispensing after the dispensing material is fully filled, and form the first glue filling layer after the dispensing material is cured, solving the problem in the prior art It is difficult to completely fill or easy to partially fill between the lower encapsulation layer and the upper encapsulation layer.

Description

[0001] This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on January 4, 2017, the application number is 201710005412.8, and the invention title is "a PoP upper-layer underfill packaging method and mobile terminal", the entire content of which is incorporated by reference In this application. Technical field [0002] This application relates to the field of electronic equipment, and in particular to a stacked package structure and a terminal. Background technique [0003] In order to meet the requirements of portable and wearable devices for lightness, thinness and shortness, the solution of stacking upper and lower packages such as memory and application processor through a package on package (PoP) has been more and more widely used. As the largest electronic component in the terminal product, PoP faces severe mechanical and environmental reliability risks. For example, the solder joints between the boards (between the PoP and...

Claims

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Application Information

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IPC IPC(8): H01L25/00H01L23/13H01L23/31
CPCH01L23/13H01L23/31H01L25/00H01L2924/181H01L2224/16225H01L2224/16145H01L2224/32145H01L2924/00012
Inventor 史洪宾叶润清龙浩晖
Owner HUAWEI TECH CO LTD