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Flexible electronic device and manufacturing method thereof

A technology for electronic devices and manufacturing methods, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as internal circuit disconnection, structural fracture, etc., to improve flexibility, improve yield or reliability, and reduce damage. Effect

Active Publication Date: 2020-06-23
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the flexible electronic product is in a flexed or bent state, it may cause structural fracture due to stress, which may further cause the internal circuit to be disconnected.

Method used

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  • Flexible electronic device and manufacturing method thereof
  • Flexible electronic device and manufacturing method thereof
  • Flexible electronic device and manufacturing method thereof

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Embodiment Construction

[0095] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

[0096] In the drawings, the thickness of each element and the like is exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on," "connected to," or "overlapping" another element, it can be directly on the other element. on or connected to another element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there...

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Abstract

A flexible electronic device includes a flexible substrate, a wire structure, and an elastic layer. The flexible substrate has a first surface and a second surface opposite the first surface. The second surface of the flexible substrate includes a plurality of trenches. The wire structure is on the first surface of the flexible substrate. The trench of the flexible substrate is filled with the elastic layer. The Young's modulus of the elastic layer is smaller than the Young's modulus of the flexible substrate. A method of manufacturing the flexible electronic device is also proposed.

Description

technical field [0001] The present invention relates to an electronic device and its manufacturing method, and in particular to a flexible (flexible) electronic device and its manufacturing method. Background technique [0002] With the high development of electronic technology, electronic products are constantly being introduced. In order for electronic products to be applied in different fields, the characteristics of flexibility, thinness, and unlimited appearance are gradually being paid attention to. That is to say, electronic products are gradually required to have different appearances according to different application methods and application environments, and are often required to be flexed or bent due to user needs. [0003] However, when the flexible electronic product is in a flexed or bent state, it may cause structural breakage due to stress, which may further cause disconnection of internal circuits. Therefore, how to make the flexible electronic products st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/12
CPCH01L23/12
Inventor 萧翔允林恭正许庭毓江丞伟陈佳楷
Owner AU OPTRONICS CORP