LED lighting device and manufacture method thereof

A technology for LED lighting and manufacturing methods, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as unfavorable package reliability, LED pad damage, etc., to save solder, prevent warpage, and prevent temperature differences. Effect

Active Publication Date: 2018-11-13
JIANGSU FURUIDE OPTICAL
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  • Abstract
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Problems solved by technology

[0002] Most of the existing LED packages are in the form of COB, such as attached figure 1 A plurality of LED chips 2 are mounted on the insulating substrate 1, and the LED chips 2 are flip-chip mounted on the insulating substrate 1, and then sealed with an encapsulation resin 4, and the insulating substrate 1 is dr

Method used

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  • LED lighting device and manufacture method thereof
  • LED lighting device and manufacture method thereof
  • LED lighting device and manufacture method thereof

Examples

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[0026] See Figure 2-8 , The manufacturing method of the LED lighting device of the present invention includes:

[0027] (1) Reference figure 2 , Providing a ceramic substrate 11 having a first surface and a second surface opposite to each other, and a plurality of annular blind holes 12 are formed on the first surface by using laser grooving technology;

[0028] (2) Reference image 3 with 4 , A plurality of LED chips 13 are distributed on the first surface with their pads 14 facing the first surface. The pads 14 correspond to the annular blind holes 12 one by one, and the LED chips 13 completely cover the annular blind hole 12, and form a plastic encapsulation layer 15 on the first surface, and the plastic encapsulation layer 15 completely covers the LED chip 13;

[0029] (3) Reference Figure 5 , The second surface is thinned by mechanical polishing until the annular blind hole 12 is exposed;

[0030] (4) Reference Image 6 , The plurality of ceramic pillars 17 in the annular blin...

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Abstract

The invention provides an LED lighting device and a manufacture method thereof. Blind holes are pre-formed and made into through holes, so that no damage is caused to a pad; ceramic posts with a solder layer are used as conductive terminals, so that fixation to a ceramic substrate can be enhanced, and solder can be saved. In addition, the ceramic posts and the ceramic substrate are of same material, and therefore, temperature differences due to different heat conductivity coefficients can be prevented, and warping can be prevented.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an LED lighting device and a manufacturing method thereof. Background technique [0002] Most of the existing LED packages are in the form of COB, such as attached figure 1 A plurality of LED chips 2 are mounted on the insulating substrate 1, and the LED chips 2 are flip-chip mounted on the insulating substrate 1, and then sealed with an encapsulation resin 4, and the insulating substrate 1 is drilled on the back and filled with a conductive material to form a through hole 3 In order to realize the terminal lead-out of the LED chip, it needs to realize the drilling through laser drilling or etching process, which will cause damage to the pad of the LED in the final stage, which is not conducive to the reliability of the package. Contents of the invention [0003] Based on solving the above problems, the present invention provides a method for manufacturing an LED lighting devi...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62
CPCH01L25/0753H01L33/48H01L33/62H01L2933/0033H01L2933/0066
Inventor 侯立东崔文杰
Owner JIANGSU FURUIDE OPTICAL
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